DUBLIN, April 18, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "Flip Chip Technology Market by Wafer Bumping Process, Packaging Technology, Application and Geography - Global Forecast to 2022 " report to their offering.
The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.
Owing to the growing demand for increasing density, higher bandwidth, and lower power, design teams are expected to adopt 3D ICs with TSVs, which promise more than Moore' integration by packaging a great deal of functionality into small form factors, while improving performance and reducing costs.
Smartphones & tablets are observed to have the highest adoption among all the consumer electronic devices, owing to their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. The automotive market is expected to grow at a second-highest CAGR rate, catapulting the flip chip technology market further.
The APAC held a large share of the overall flip chip technology market in 2015; moreover, the market in APAC is expected to grow at the highest CAGR between 2016 and 2022. Countries in Asia-Pacific are major manufacturing hubs and are expected to provide ample opportunities for the growth of the flip chip technology. The growing demand for high performance in smartphones and automotive MCUs is driving the market in this region.
Key Topics Covered:
2 Research Methodology
3 Executive Summary
4 Premium Insights
5 Market Overview
6 Industry Trends
7 Flip Chip Technology Market, By Wafer Bumping Process
8 Flip Chip Technology Market, By Packaging Technology
9 Flip Chip Technology Market, By Packaging Type
10 Flip Chip Technology Market, By Product
11 Flip Chip Technology Market, By Application
12 Geographic Analysis
14 Company Profiles
- ASE Group
- Amkor Technology
- Intel Corporation
- JCET, Co., Ltd.
- Powertech Technology
- SPIL, Co., Ltd.
- STATS ChipPAC
- TSMC, Ltd.
- United Microelectronics Corporation
For more information visit http://www.researchandmarkets.com/research/bbtk64/flip_chip
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SOURCE Research and Markets