DUBLIN, Oct. 06 2015 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/6p8jdq/the_worldwide_ic) has announced the addition of the "The Worldwide IC Packaging Market 2015 Edition" report to their offering.
While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more ICs to be integrated into more products over time. The market is being driven by demand for handheld consumer devices as well as advanced computing products. All product segments (consumer, computer, communications, transportation,industrial) are benefiting and leading to new product innovation.
Following an unexpectedly robust year of growth (9.2%), in 2014, the semiconductor industry moderated its expansion in the first half 2015. While the rate of growth for both semiconductors shipped and worldwide revenues will decline some what in the second half of 2016 (election year), the market is expected to post a respectable CAGR of 4.2% over the next five years.
This report analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market by package type and application. The report begins with an economic and industry overview, then examines the historic and future unit and revenue IC growth.
Following this high-level review, the report presents forecasts for the total worldwide IC packaging marketplace (Chapter 4), and explains the market segmentation defined by NVR.
Next, the report dives deeply into an analysis of each semiconductor product type (Chapter 5), and segments these products by package family, I/O count range and general market application. The analysis returns to the individual package families (Chapter 6) and presents each in terms of semiconductor devices and I/O count. In all tables, unit shipments and revenue figures are displayed for each segment.
Next, the report presents NVR's continuing coverage of the outsourced semiconductor assembly and test (OSAT) market. These companies already comprise a significant share of the worldwide IC packaging market and will continue to grow in importance in the coming years. The report presents the total OSAT market in terms of both unit shipments and revenues. To help you further assess this group of companies, the report profiles the activities of the leading OSAT companies and the packages they offer.
Key Topics Covered:
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the Industry
Chapter 4: Worldwide IC Packaging Market
Chapter 5: IC Package Market Analysis and Forecasts by Semiconductor Device - 2013-2019
Chapter 6: IC Package Market Analysis and Forecasts by Packaging Family - 2013-2019
Chapter 7: OSAT Market Analysis and Forecasts
Chapter 8: OSAT Company Profiles
- 3D Plus, Inc.
- AIC Semiconductor
- Anst China
- Chant World Technology
- China Wafer Level CSP
- CONNECTEC Japan
- CORWIL Technology
- Deca Technologies
- FlipChip Int'l
- Greatek Electronics
- HANA Microelectronics
- HANA Micron
- I2a Technology
- Jiangsu Changjiang
- Lingsen Precision
- Nantong Fujitsu
- Shinko Electric
- STATS ChipPAC
- Tera Probe
- Tianshui Huatian Tech
For more information visit http://www.researchandmarkets.com/research/6p8jdq/the_worldwide_ic
Media Contact: Laura Wood , +353-1-481-1716, firstname.lastname@example.org
SOURCE Research and Markets