DUBLIN, Oct. 8, 2014 /PRNewswire/ -- Research and Markets has announced the addition of the "The Worldwide IC Packaging Market - 2014 Edition" report to their offering.
While the integrated circuit (IC) market tends to be cyclical in nature, the general trend is for more ICs to be integrated into more products over time. The market is being driven by demand for handheld consumer devices as well as advanced computing products. All product segments (transportation, medical/industrial, communications and computers) are expanding rapidly with advances in semiconductor packaging technology leading innovation.
Following an unexpectedly robust year of growth (7.9%), in 2013, the semiconductor industry appears to have recovered its former strength after the devastating economic downturn at the end of the last decade. While the rate of growth for both semiconductors shipped and worldwide revenues will decline somewhat, the market is expected to post a respectable compounded growth of more than 4% over the next five years.
This report analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market. The report begins with an economic and industry overview, then examines the historic and future unit and revenue IC growth.
Following this high-level review, the report presents forecasts for the total worldwide IC packaging marketplace (Chapter 4), and explains the market segmentation. Next, the report dives deeply into an analysis of each semiconductor product type (Chapter 5), and segments these products by package family and I/O count range. The analysis returns to the individual package families (Chapter 6) and presents each in terms of semiconductor devices and I/O count. In all tables, unit shipments and revenue figures are displayed for each segment.
Next, this report presents continuing coverage of the outsourced semiconductor assembly and test (OSAT) market. These companies already comprise a significant share of the worldwide IC packaging market and will continue to grow in importance in the coming years. The report presents the total OSAT market in terms of both unit shipments and revenues. To help you further assess this group of companies, the report profiles the activities of the leading OSAT companies and the packages they offer. The Worldwide IC Packaging Market, 2014 Edition continues it's leadership position in assessing the status and future of IC packaging. This report is an effective and economical tool for any company associated in the semiconductor industry to aid in assessing their own markets and potential areas of growth.
- Economic Overview
- Semiconductor Industry Analysis
Worldwide IC Packaging Market Forecasts, 2012-2018
- Package Prices
- Packaging Revenue
- By Semiconductor Product
- By Package Family
- By I/O Range
OSAT IC Packaging Market Forecasts, 2012-2018
- Package Prices
- Packaging Revenue
- Competitive Rankings
- Company Profiles
- Report Highlights
Key Topics Covered:
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: The State of the Industry
Chapter 4: Worldwide IC Packaging Market Analysis and Forecasts - 2012-2018
Chapter 5: IC Package Market Analysis and Forecasts by Semiconductor Device - 2012-2018
Chapter 6: IC Package Market Analysis and Forecasts by Packaging Family - 2012-2018
Chapter 7: OSAT Market Analysis and Forecasts
Chapter 8: OSAT Company Profiles
Appendix A: Glossary of Packaging Terms
- 3D Plus, Inc.
- AIC Semiconductor
- Anst China
- CORWIL Technology
- Deca Technologies
- FlipChip Int'l
- HANA Microelectronics
- HANA Micron
- Jiangsu Changjiang
- Nantong Fujitsu
- STATS ChipPAC
- Shinko Electric
- Tera Probe
- Tianshui Huatian Tech
- Vigilant Technology
- i2a Technology
For more information visit http://www.researchandmarkets.com/research/sm96v7/the_worldwide_ic
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SOURCE Research and Markets