DUBLIN, February 5, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems) has announced the addition of the "Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm" report to their offering.
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STMicroelectronics 4x4mm MEMS gyro was integrated in the previous iPhones (iPhone 4, 4S & 5). For the new iPhone 5S, Apple has chosen the latest 3x3mm MEMS gyro from ST, thus achieving a 45% footprint reduction.
The new 3-Axis MEMS gyroscope is assembled with a true CSP process (Chip Scale Packaging) allowing a package efficiency of 75% (silicon area/package area). This packaging size reduction combined with dies shrinking allowed ST to reduce by 20% the production cost of their latest gyro.
This report provides a complete teardown of the MEMS gyro with:
Key Topics Covered:
Glossary
Overview/Introduction
STMicroelectronics Company Profile
Physical Analysis
Comparison with iPhone 4/4S/5 Gyroscope
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
For more information visit http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems
Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net
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