Reverse Costing Analysis of the Infineon FS600R07A2E3 HybridPACK2 100KW 3-phase Reverse Costing Analysis

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Research and Markets

05 Feb, 2014, 18:13 GMT

DUBLIN, Feb. 5, 2014 /PRNewswire/ --Research and Markets (http://www.researchandmarkets.com/research/p9xnzj/infineon) has announced the addition of the "Reverse Costing Analysis of the Infineon FS600R07A2E3 HybridPACK2 100KW 3-phase Reverse Costing Analysis" report to their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769)

FS600R07A2E3 is a new-power module three-phase six-pack for the automotive market from Infineon. With a maximal power of 100KW, 650V and 600A the HybridPACK2 is optimized for the hybrid and electric vehicle applications.

The HybridPACK2 has a pin-fin base plate ready for direct liquid cooling. The power module integrates the ultra-thin IGBT3 and ultra-thin EMCON3 diodes from Infineon. The new wire-bonding-less DBC contact technology improves the reliability of the module when compared to the previous HybridPACK1.

This reverse costing report on the FS600R07A2E3 is based on a complete teardown analysis (power module, mechanical parts, IGBTs and Diodes), the report provides an estimation of the production cost of HybridPACK2 module, IGBT3 transistor and EMCON3 diode.

The reverse costing report contains:

  • Detailed photos and identification
  • Bill of Material (module)
  • Manufacturing process flow Module, IGBT Diode
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Key Topics Covered:

Glossary

1. Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

2. Company Profile

3. Physical Analysis

  • Synthesis of the Physical Analysis
  • Package analysis
  • Characteristics and marking
  • Housing
  • Base Plate Cross-Section
  • DBC Cross-Section
  • IGBT Analysis
  • Dimension
  • Guard Ring
  • Trench Gate Cross-Section
  • Revelation
  • Diode Analysis
  • Dimension
  • Guard Ring
  • Revelation

4. Manufacturing Process Flow 54

  • Overview
  • IGBT and Diode Process Flow
  • Description of the Wafer Fabrication Units
  • IGBT Process Flow
  • Diode Process Flow
  • Package Process Flow

5. Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Explanation
  • Cost Analysis IGBT
  • Wafer Cost Hypothesis
  • IGBT Wafer Cost
  • Breakdown per process step
  • IGBT Equipment Cost per Family
  • IGBT Material Cost per Family
  • IGBT Probe Cost
  • IGBT Die cost
  • Cost Analysis Diode
  • Cost Analysis FS600R07A2E3
  • Assessing BOM
  • DBC Cost
  • FS600R07A2E3 Module Cost
  • Yield Synthesis

6. Estimated Manufacturer Price Analysis

  • Manufacturers ratios
  • Estimated manufacturer Price

For more information visit http://www.researchandmarkets.com/research/p9xnzj/infineon

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets