Reverse Costing Analysis of InvenSense's MP67B Gyroscope for the iPhone 6 and 6 Plus

DUBLIN, Feb. 23, 2015 /PRNewswire/ --Research and Markets

(http://www.researchandmarkets.com/research/9npkpr/_invensense_mp67b) has announced the addition of the " InvenSense MP67B - Reverse Costing Analysis" report to their offering.

With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.

The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense's standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.

The MP67B uses the same process as InvenSense's second generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

Key Topics Covered:

1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

2. Company Profile
- InvenSense Profile
- iPhone 6 Teardown

3. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology

Package
- Package View & Dimensions
- Package Opening
- Package Cross-Section

Die
- View, Dimensions & Marking
- MEMS Removed
- MEMS Sensing Area: Gyroscope
- MEMS Sensing Area: X/Y-Axis Accelerometer
- MEMS Sensing Area: Z-Axis Accelerometer
- MEMS Cap- ASIC Delayering & Process
- Die Cross-Section: ASIC
- Die Cross-Section: MEMS (Pads Opening)
- Die Cross-Section: MEMS (Sealing)
- Die Cross-Section: Sensor (Electrical Contacts)
- Die Cross-Section: Sensor (Standoffs)
- Die Cross-Section: Sensor (Al-GE Bonding)
- Die Cross-Section: Sensor (Mobile Elements)
- Die Cross-Section: Cap

- Comparison with MPU-6

- Comparison with previous generation

5. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit

6. Cost Analysis
- Synthesis of the cost analysis- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- ASIC/MEMS Assembly Cost
- MEMS Front-End Cost per process steps
- Total Front-end Cost
- Back-End : Probe Test & Dicing
- Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test & Calibration Cost
- Component Cost

7. Estimated Price Analysis
- InvenSense Financial Ratios
- Component Estimated Price

For more information visit http://www.researchandmarkets.com/research/9npkpr/_invensense_mp67b
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

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