Reverse Costing Analysis of InvenSense's ICS-43432 Microphone
DUBLIN, Feb .17, 2015 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/9m47v2/invensense) has announced the addition of the "InvenSense ICS-43432 Microphone - Reverse Costing Analysis" report to their offering.
Following the acquisition of MEMS Microphone Business Line of Analog Devices for 100M$ in October 2013, InvenSense releases its last high performances digital MEMS Microphone based on flexible membrane and capacitive common sensing principle.
The ICS-43432 is a digital microphone equipped with MEMS and amplification ASIC into a single chip. It is designed by CMOS process, it has I²S protocol interface and high SNR of 65dBA.
The MEMS transducer is a condenser microphone with a flexible poly-Si membrane and a rigid reference electrode manufactured on SOI substrate. Compared with state of the art MEMS Microphones, it presents a new design of the diaphragm with octagonal shape and centralfixation.
Assembled in a 6-pins LGA4.0x3.0x1.0mm package, the ICS-43432 is an high performance digital output microphone with bottom port targeted for consumers applications.
Key Topics Covered:
1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology
2. Company Profile
- InvenSense
- Digital Microphones portfolio
3. Physical Analysis
- Synthesis of the Physical Analysis
- Device Design
- Physical Analysis Methodology
Package
- Package Views & Dimensions
- Package Opening
- Package Cross-Section
ASIC Die
- View & Dimensions
- Die Marking
- Die Delayering
- Die Process
- Die Cross-Section
- Process Characteristics
MEMS Die
- View & Dimensions
- Marking
- Dicing
- Bond Pads
- Membrane & Backplate
- Central Support
- Anti-Stiction holes
- Cavity- Cross-Section
- MEMS Characteristics
4. Manufacturing Process Flow
- Global Overview
- ASIC Front
- End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow- MEMS Wafer Fabrication Unit
- Packaging Process Flow- Package Assembly Unit
5. Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields Explanation
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing- ASIC Wafer Cost
- ASIC Die Cost- MEMS Front-End Cost
- MEMS Front-End Cost per process steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Wafer Cost- MEMS Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost- Microphone Component Cost
6. Estimated price Analysis
- Manufacturer financial ration
- Microphone Component Price
For more information visit http://www.researchandmarkets.com/research/9m47v2/invensense
Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net
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