Research and Markets -Technology and Cost Comparison of InvenSense's ICM-30630 - 6-axis Device (3-axis gyroscope + 3-axis accelerometer)

DUBLIN, May 19, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "InvenSense ICM-30630: Technology and Cost Comparison"  report to their offering.

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With the emergence of connected objects and wearable devices like the personal fitness coach, InvenSense offers in the ICM-30630 a competitive, complete motion-tracking solution. 

The ICM-30630 is the latest version of InvenSense's 6-axis device (3-axis gyroscope + 3-axis accelerometer), based on the same technology used in smartphones like the Apple iPhone, with a MCU included in the package. Compared with the stand-alone sensor hub, this approach eliminates a package and reduces system-level power. 

In competition with Bosch Sensortec and STMicroelectronics, InvenSense provides a low-power, highly programmable device for consumer electronics. 

ICM-30360 MEMS sensors are fabricated with a low number of masks and are directly assembled on the ASIC by eutectic bonding. The device is shipped in a 3x3x1mm LGA package whose footprint is the same as the previous generation IMU. 

Using knowledge obtained from previous acquisitions, InvenSense was able to design its own MCU, which provides a fully open platform. 

This report also features a detailed technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense's incredibly smart design. 

Key Topics Covered: 

Overview / Introduction 

InvenSense Company Profile 

Physical analysis 

- Package 
-- Package characteristics: view, dimensions, and opening 
-- Package cross-section 

- MEMS Die 
-- View, dimensions, and markings 
-- MEMS sensing area: technical description 
-- MEMS cap removed 
-- ASIC delayering and process 
-- Die cross-section: ASIC 
-- Die cross-section: MEMS cap and sensor 

- MCU Die 
-- View, dimensions, and markings 
-- Delayering and main block ID 
-- Process and die cross-section 
-- Die process characteristics 

Manufacturing Process Flow 

- Global overview 
- ASIC & MCU front-end process 
- MEMS process flow 
- ASIC & MCU wafer fabrication unit 
- Packaging process flow and assembly unit 

Cost Analysis 

- Main steps of economic analysis 
- Yields hypotheses 
- ASIC front-end cost 
- MEMS front-end cost 
- ASIC/MEMS assembly cost 
- MEMS front-end cost per process steps 
- Total front-end cost 
- Back-end 0: probe test and dicing 
- Wafer and die cost 
- MCU front-end and back-end 0 cost 
- MCU die cost 
- Back-end: packaging cost 
- Back-end: packaging cost per process steps 
- Back-end: final test cost 
- Component cost and price 

Cost & price comparison with Bosch Sensortec 9-Axis Sensor Hub BMF055 

Companies Mentioned 

- Bosch Sensortec 
- InvenSense 
- STMicroelectronics 

For more information visit http://www.researchandmarkets.com/research/fd666w/invensense

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