Research and Markets - Technology and Cost Comparison of BOSCH Sensortec's BMF055: The Industry's First Custom-Programmable 9-Axis Motion Sensor
DUBLIN, May 19, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "BOSCH Sensortec BMF055: Technology and Cost Comparison" report to their offering.
Like its competitor InvenSense, BOSCH Sensortec has unveiled a programmable all-in-one motion sensor for robotics, gaming, and household IoT devices, touted as the industry's first custom-programmable 9-axis motion sensor.
The BMF055 is a new version of the BOSCH Sensortec 9-axis device (3-axis Gyroscope + 3-axis Accelerometer + 3-axis Magnetometer), with a MCU included in the package. Compared to the stand-alone sensor hub, this new approach eliminates a package and reduces system-level power. This device integrates six-chip in a complex System-in-Package.
The sensor hub combines a 14-bit accelerometer, a 16-bit gyroscope, and a geomagnetic sensor with a 32-bit ARM Cortex M0+ core. Compared to rivals, BOSCH Sensortec targets a broader range of customer applications with a high precision-sensor and dedicated MCU.
With BOSCH Sensortec's approach, the MEMS sensor and the ASIC are fabricated separately. Final assembly entails wire bonding of all parts . The BMF055 is shipped in a 5.8×3.2×1.15mm LGA package, a footprint that's larger than the competition.
This report features a detailed technology and cost comparison with the leading-edge sensor hub from InvenSense, highlighting the different choices from the two different designers.
Key Topics Covered:
Overview / Introduction
Bosch Company Profile
Physical analysis
- Package -- Package characteristics: view, dimensions, and opening -- Package cross-section
- ASIC Dies
-- View, dimensions, and markings
-- Delayering and main blocks ID
-- Cross-section
-- Process characteristics
- MEMS Dies -- View, dimensions, and markings -- Bond pad opening and bond pad -- MEMS cap removed and details -- Sensing area details -- MEMS cross-section -- MEMS process characteristics
- MCU Die
-- View, dimensions, and markings
-- Delayering and main blocks ID
-- Process and die cross-section
-- Die process characteristics
- Magnetometer Die -- View, dimensions, and markings -- Hall sensor and fluxgate sensor -- Delayering and main blocks ID -- Process and die cross-section -- Die process characteristics
Manufacturing Process Flow
- Global overview - ASIC front-end process - MEMS process flow - Magnetometer process flow - ASIC, MEMS, and MCU wafer fabrication unit - Packaging process flow and assembly unit
Cost Analysis
- Main steps of economic analysis - Yields hypotheses - ASIC & MCU front-end cost - ASIC & MCU back-end 0: probe test and dicing - ASIC & MCU wafer & die cost - MEMS front-end cost - MEMS front-end cost per process steps - MEMS back-end 0: probe test and dicing - MEMS wafer and die cost - Magnetometer CMOS front-end cost - Magnetometer sensor cost - Magnetometer sensor cost per process steps - Magnetometer back-end 0: probe test and dicing - Magnetometer wafer and die cost - Back-end: packaging cost - Back-end: packaging cost per process steps - Back-end: final test cost - Component cost and price
Cost & price comparison with InvenSense ICM-30630 6-Axis Sensor Hub
For more information visit http://www.researchandmarkets.com/research/lbtdnp/bosch_sensortec
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