DUBLIN, June 27, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "Thermal Interface Materials 2016-2026: Status, Opportunities, Market Forecasts" report to their offering.
Overheating is the most critical issue in the computer industry. It limits further miniaturisation, power, performance and reliability. The escalation of power densities in electronic devices has made efficient heat removal a crucial issue for progress in information, communication, energy harvesting, energy storage and lighting technologies. As long as electronic systems aren't monolithic, but are built from a wide range of materials such as metals, polymers, ceramics and semiconductors, there will be a need for thermal interface materials.
The contact area between high power, heat generating components and heat sinks can be as low as 3%, due to the micro-scale surface roughness. Thermal interface materials are required to enhance the contact between the surfaces, and decrease thermal interfacial resistance, and increase heat conduction across the interface.
Proper selection of Thermal Interface Materials (TIM) is crucial for the device efficiency. Instead of sophisticated cooling technique, it is often better to invest in the interface material. Without good thermal contact, the use of expensive thermally conducting materials for the components is a waste.
The state of the market in 2016, a geographic breakdown of the market, and forecasts to 2026, are separated by TIM type and by application. These have been compiled after an extensive interview program with thermal interface material manufacturers making a variety of materials, and many different applications, and using financial data published by public companies. Thermal Interface Materials 2016-2026 includes profiles of 31 companies working in this industry.
- 3M Electronic Materials
- AI Technology
- AIM Specialty Materials
- AOS Thermal
- DK Thermal
- Dow Corning
- Dymax Corporation
- Ellsworth Adhesives
- European Thermodynamics Ltd
- Indium Corporation
- Kitagawa Industries
- Laird Tech
- MA Electronics
- MH&W International
- Parker Chomerics
- Schlegel Electronics Materials
- Universal Science
1. EXECUTIVE SUMMARY
4. CHARACTERISING TIMS
5. TYPES OF THERMAL INTERFACE MATERIAL
6. BENCHMARKING OF THERMAL INTERFACE MATERIALS
7. RELATED TECHNOLOGIES
8. EMERGING MATERIALS AND DISRUPTIVE TECHNOLOGIES
10. EMERGING APPLICATIONS
11. PATENTS AND PUBLICATIONS
12. VALUE CHAINS
13. STATE OF THE MARKET IN 2016
14. FORECAST 2016-2026
15. LIMITATIONS, RESTRAINTS AND THREATS
16. THE WINNERS WILL ADDRESS...
17. COMPANY PROFILES
For more information visit http://www.researchandmarkets.com/research/fw6mkh/thermal_interface
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SOURCE Research and Markets