DUBLIN, November 7, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "Global Fan-in Wafer Level Packaging Market 2016-2020" report to their offering.

The global fan-in WLP market is forecast to grow at a CAGR of 9.63% during the period 2016-2020.

Commenting on the report, an analyst from the research team said: One trend gaining popularity in this market is increase in wafer size. The global semiconductor industry witnessed an increase in the size of silicon wafers, from 100 mm to 300 mm, during the last four decades. The shift to larger diameter wafers reduces the cost of manufacturing semiconductor ICs by 20%-25%. At present, the industry predominantly uses 300-mm wafers to manufacture ICs. This trend is expected to maintain its momentum during the forecast period

According to the report, the surging demand for compact electronic devices in sectors such as telecommunications, automotive, industrial manufacturing, and healthcare has generated the need for miniaturized semiconductor ICs. With the emergence of products such as 3D ICs and MEMS devices, the electronic equipment is becoming compact and user-friendly, which involves changes in IC designing such as finer patterning.

Further, the report states that rapid technological advances in wafer processing is a major challenge for vendors in the global fan-in WLP market. The transitions such as miniaturization of nodes and an increase in wafer sizes in ultra-large scale integration (ULSI) fabrication technology in the global semiconductor industry instigate semiconductor manufacturers to increase the development and adoption of new technologies, especially in packaging solutions.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Questions Answered:

• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

Companies Mentioned:

• STATS ChipPAC
• STMicroelectronics
• TSMC
• Texas Instruments
• Rudolph Technologies
• SEMES
• SUSS MicroTec
• Ultratech
• FlipChip International

Report Structure:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Market research methodology

PART 04: Introduction

PART 05: Technology landscape

PART 06: Market landscape

PART 07: Market segmentation by application

PART 08: Geographical segmentation

PART 09: Market drivers

PART 10: Impact of drivers

PART 11: Market challenges

PART 12: Impact of drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

PART 15: Market summary

PART 16: Appendix

PART 17: About the Author

For more information about this report visit http://www.researchandmarkets.com/research/9s6j4q/global_fanin

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SOURCE Research and Markets