The global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.
Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
One trend which will boost market growth is the migration to smaller diameter wires. The semiconductor industry is constantly evolving amid rapid advances in technology and miniaturization, which will lead to bonding wires with smaller diameters. Reduction in wire diameter is an effective way to reduce costs in the bonding wire packaging material market, as gold content accounts for the majority of bonding wire expense.
According to the report, a key growth driver is the rising need for miniaturization. The increasing demand for miniaturization in the semiconductor industry has made bonding wires an important part of electronic assemblies. Fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are used for the production of bonding wires. The uniformity of the wires with quality is in high demand. Vendors need to constantly upgrade their offerings with more advanced and compact packaging materials, such as bonding wires with smaller diameters, to cater to consumer requirements.
Further, the report states that one challenge that could impact market growth is the migration to flip chip packaging technology. A flip chip eliminates the primary technical limitations of wire bonding by providing an area-array interconnect and reducing interconnect inductance, which helps in higher frequency performance.
- TANAKA Precious Metals - Heraeus Deutschland - California Fine Wire - MK Electron
Other prominent vendors
- AMETEK - EMMTECH - Inseto - Palomar Technologies - RED Micro Wire - SHINKAWA - Sumitomo Metal Mining - Tatsuta Electric Wire & Cable