CARY, North Carolina, May 5, 2015 /PRNewswire/ -- The collective lead time index for passive electronic components had been in a volatile state on a month-to-month basis but has been consistently improving since May of 2014- a trend which has continued into May of 2015. The lead-time index, which shows the average time in weeks that it takes for a passive electronic component manufacturer to deliver an ordered part to a customer, is extremely sensitive and responds to various external stimuli that are sometimes natural but usually manmade. For all of 2012 and the balance of 2013 the lead-time index has expressed an anemic trend of relative inactivity. In the second half of 2014 and the first half of 2015 it is apparent that unit demand for capacitors, resistors and inductors has been steadily increasing to satisfy demand coming from smartphone, tablet, automotive under-the-hood, commercial aerospace, medical implant and specialty industrial customers, however, the weakened yen, won and NT$ to the US dollar is creating excessive price erosion in all world regions where vendors compete, thus creating almost no growth when measured globally. With a wary eye toward the Internet of Everything, 3D-printing and space electronics, many component manufacturers are now transitioning toward value-added and applications specific end-use market segments that require added tooling and captive intellect encompassing a granular understanding of high voltage, high frequency and harsh environment end-use markets, technologies and opportunities with an eye to the future and a five year growth plan for success. This and much more in the new market research report from Paumanok Publications, Inc. entitled "Passive Electronic Components: World Market Outlook: 2015-2020 ISBN #1-893211-99-1 (2015)" that tracks the global market for 20 different types of passive electronic component on a global basis with forecasts to 2020. Now in its 27th year.
Keywords: Ceramic Capacitors, tantalum capacitors, aluminum electrolytic capacitors, AC plastic film capacitors; DC plastic film capacitors, EDLC supercapacitors, niobium capacitors; chip resistors, resistor networks, resistor arrays, nichrome resistors, carbon film resistors, tin-oxide resistors, thin film resistors; ferrite beads, ferrite bead arrays, axial and radial molded micro inductors, ferrite cores, integrated passive devices.