Huawei LTE-FDD Baseband Unit WD2BBBUC-HERT BBU Model BBU3900

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09 Sep, 2014, 14:37 GMT

DUBLIN, Sept. 9, 2014 /PRNewswire/ -- Research and Markets has announced the addition of EJL Wireless Research's new report "Huawei LTE-FDD Baseband Unit WD2BBBUC-HERT BBU Model BBU3900 " to their offering.

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Design Analysis Huawei Technologies FDD LTE Baseband Unit (BBU)

This report covers the design analysis of a Huawei Technologies FDD LTE. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

  • Modular chassis allows for single mode and multi-mode operation
  • LBBPc card allows for capacity up to 2T2R 3 x 20MHz or 4T4R 3 x 10MHz

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.

Features

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description

Package Type

  • Total Pages: 68
  • Total Tables: 23
  • Total Exhibits: 68

Important Note: There is NO component pricing contained within the report.

Key Topics Covered:

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note

CHAPTER 1: HUAWEI TECHNOLOGIES DBS3900 BTS SYSTEM

  • Overview of DBS3900 Product Offering

CHAPTER 2: BSBC MECHANICAL ANALYSIS

  • Mechanical Analysis
  • BSBC Backplane PCB

CHAPTER 3: FAN UNIT (UBFA)

CHAPTER 4: UPEUC

CHAPTER 5: LTE CONFIGURATION

CHAPTER 6: LMPT

CHAPTER 7: LBBP

APPENDIX A - PASSIVE CASE SIZE ANALYSIS
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES
Table 1: BSBC PCB Bill of Materials, Top
Table 2: BSBC PCB Bill of Materials, Bottom
Table 3: Fan Unit Bill of Materials
Table 4: Fan Unit PCB, Top Bill of Materials
Table 5: Fan Unit PCB, Bottom Bill of Materials
Table 6: UPEU Ethernet PCB Bill of Materials
Table 7: UPEU Main PCB Area A Bill of Materials
Table 8: UPEU Main PCB Area B Bill of Materials
Table 9: LMPT Top View Bill of Materials
Table 10: LMPT Top View Area A Bill of Materials
Table 11: LMPT Top View Area B Bill of Materials
Table 12: LMPT Bottom View Area B Bill of Materials
Table 13: LMPT Top View Area C Bill of Materials
Table 14: LMPT Bottom View Area C Bill of Materials
Table 15: LMPT Bottom View Bill of Materials
Table 16: LBBP Variant Specifications
Table 17: LBBP Variant Maximum Data Rate Support
Table 18: LBBP Top View Bill of Materials
Table 19: LBBP Bottom View Bill of Materials
Table 20: Passive Component Case Size Distribution by System Subsection
Table 21: Identified Passive Component Supplier Distribution by System Subsection
Table 22: Active/Passive Component Distribution by System Subsection
Table 23: Active Semiconductor/Component Vendor Distribution by System Subsection

Companies Mentioned:

  • Analog Devices
  • Fairchild Semiconductor
  • HiSilicon Technologies
  • Integrated Device Technology
  • Maxim Integrated Products
  • Micrel
  • NXP Semiconductors
  • ON Semiconductor
  • STMicroelectronics
  • Texas Instruments
  • Vishay Semiconductors

For more information visit http://www.researchandmarkets.com/research/9tvfwg/huawei_ltefdd

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net