Global TSV 3D IC Industry Future Market Trends Report

DALLAS, December 15, 2014 /PRNewswire/ --

ReportsnReports.com adds Future Trends of the Worldwide TSV 3D IC Industry research report published in Dec 2014 and providing global industry value forecast up to 2017 and major players' development plan in 2015 and 2016.

The Future Trends of the Worldwide TSV 3D IC Industry research report discusses companies like Altera, AMD, Amkor, ARM Holding, ASE Kaohsiung, GlobalFoundry, HMCC, Hynix, Inotera Memories, Micron, Samsung, STATS ChipPAC, STMicro, Toshiba, TSMC, UMC and Xilinx. Electronics devices are developing towards more compact form factors, more versatility, higher performance, and lower power consumption, driving IC packaging technologies towards SiP (System-in-Package) from single chip package. Among various SiP technologies, TSV 3D IC (Through-Silicon-Via) which vertically interconnects stacked dies using TSV technology has been considered the future packaging technology due to its high space efficiency and performance.

Up to now, TSV 3D IC technology has only been applied to the integration of homogeneous chips, resulting in a low industrial value. However, the situation is about to change as some foreign vendors are projected to make technological progress. This report provides the overview development of TSV 3D IC from the aspects of technology, market, and industry. Topics discussed and covered in this research include:

Overview of the development of global packaging technology SiP (System-in-Package), in particular TSV (Through-Silicon-Via) 3D IC technology; four major production processes and existing challenges of TSV 3D IC in stacking, circuit, stress, heat dissipation, yield and cost are also covered

Development of the TSV 3D IC market and industry, including the global industry value forecast up to 2017 and major players' development plan in 2015 and 2016; also provided are those players' mass production timetable for TSV 3D IC

Overview of the deployment of TSV 3D IC industry alliances, covering upstream to downstream segments of fabless, foundry, memory, packaging and IDM; also included are the position of US, UK, Korean, Singaporean, and Taiwanese players in the TSV 3D IC supply chain

Order a copy of Future Trends of the Worldwide TSV 3D IC Industry research report at http://www.reportsnreports.com/Purchase.aspx?name=320464 .

Table of Contents for this report covers:

1 Development of Global Packaging Technologies

1.1 SiP to Become Mainstream Technology

1.2 TSV 3D IC: The Future Trend of Packaging Technology

1.3 Uniqueness of TSV 3D IC Technology

1.4 Existing Challenges for TSV 3D IC

1.5 Foreign Players' Leading Position in TSV 3D IC

2 Development of TSV 3D IC Market

2.1 Strong Growth Potential

2.1 Mass Production Activities Remain Low

2.2 Market Growth to Speed Up with Technological Enhancement

3 Development of the TSV 3D IC Industry

3.1 Formation of Cross-industry Alliances

3.2 Taiwanese IC Design Houses' Absence in HMCC

3.3 Close Cooperation between Taiwanese Upstream and Downstream Players Required

MIC Perspective

Appendix

List of Tables

Table 1 Current Challenges in TSV 3D IC Development

Table 2 Technology Development and Mass Production Timetable of Taiwanese and

Foreign TSC IC Chipmakers

Table 3 TSV-based ICs Mass Produced as of Year-end 2014

Table 4 Impact on Taiwan's Semiconductor Industry

List of Figures

Figure 1 Development of Electronic Devices and Packaging Technologies

Figure 2 Comparison of TSV 3D IC and Other Packaging Technologies

Figure 3 Production Process of TSV 3D IC

Figure 4 Worldwide TSV 3D IC Industry Value Forecast, 2014 - 2017

Figure 5 Major Players' Development Plan in 2015 and 2016

Figure 6 Comparison of Industry Alliances Worldwide

Figure 7 Participation of Taiwanese and Korean HMCC Members

The Global 3D IC market is forecast to grow at a CAGR of 18.4% over the period 2013-2018 according to another research available at http://www.reportsnreports.com/reports/311258-global-3d-ic-market-2014-2018.html . The report includes the overall revenue generated from the sales of 3D ICs. The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology. The report also presents the vendor landscape and a corresponding detailed analysis of the top four vendors in the Global 3D IC market. In addition, the report discusses the major drivers that influence the growth of the Global 3D IC market. It also outlines the challenges faced by the vendors and the market at large, as well as the key trends that are emerging in the market.

Companies like Advanced Semiconductor Engineering, Samsung Electronics, STMicroelectronics, Taiwan Semiconductor Manufacturing, 3M Company, IBM, Micron Technology, STATS ChipPAC, United Microelectronics and Xilinx are discussed in this research available for purchase at http://www.reportsnreports.com/Purchase.aspx?name=311258 .

Explore more reports on the semiconductor and electronics industry at http://www.reportsnreports.com/market-research/semiconductor-and-electronics/ .

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