DUBLIN, June 03, 2015 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/vzrxnx/thermal_interface) has announced the addition of the "Thermal Interface Material Market by Type, by Application, by Region - Trends & Forecasts to 2020" report to their offering.

The market size for Thermal Interface Materials is projected to grow at a CAGR of 11.0% between 2015 and 2020 and is estimated to increase to $962.0 Million by 2020

The report on thermal interface materials includes six different types of thermal interface materials. These are greases & adhesives, tapes & films, gap fillers, metal based TIMs, phase change materials, and others (elastomeric pads/insulators and thermal compounds). The market is witnessing high growth because of the increasing need of thermal management in electronic devices, and growing demand in APAC and North American regions. TIMs are used to fill the small voids and imperfections between the heat sinks and heat sources to minimize the interface thermal resistance. TIMs are used to bond the two components and eliminate air gaps from the interface, creating a thermally conductive bond that efficiently transfers heat from the critical operating components of the device.

APAC is the largest market for thermal interface materials followed by North America, Europe and RoW. APAC is also the fastest-growing market for TIMs, growing at a CAGR of 12.5% between 2015 and 2020. The comparatively higher growth of end-use industries in APAC region is contributing towards the higher growth of TIMs in this region.

Greases & adhesives is the largest segment (type) of TIMs followed by tapes & films. Phase change materials are the fastest-growing TIMs globally. Computer is the largest end-use application segment of TIMs followed by telecom. Medical device is the fastest-growing end-use application of TIMs throughout the world.

Thermal Interface Materials play an important role in the development of cutting-edge devices used in imaging, diagnostic, and surgical applications. The demand for thermal interface materials in medical industry is growing at a high rate, owing to the increased demand for lighter, smaller and effective medical equipment

Key Topics Covered:

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights

5 Market Overview

6 Industry Trends

7 Thermal Interface Materials Market, By Type

8 Thermal Interface Materials Market, By Application

9 Thermal Interface Material Market, By Region

10 Competitive Landscape

11 Competitive Landscape

- 3M Co.
- DOW Corning Corporation
- Henkel AG & Co. Kgaa
- Honeywell International Inc.
- Indium Corporation
- Laird Technologies, Inc.
- Momentive Performance Materials Inc.
- Parker Hannifin Corporation
- Wakefield-Vette, Inc.
- Zalman Tech Co., Ltd.
- the Bergquist Company, Inc.

For more information visit http://www.researchandmarkets.com/research/vzrxnx/thermal_interface

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

Related Links

http://www.researchandmarkets.com

SOURCE Research and Markets