DUBLIN, April 28, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "Global Epitaxy Deposition Market 2016-2020" report to their offering.

The analysts forecast the global epitaxy deposition market to grow at a CAGR of 11.54% during the period 2016-2020.

The two methods that used for epitaxial deposition are homoepitaxy and heteroepitaxy. Homoepitaxy deposition is a method of laying a film or layer on a surface or substrate of a similar level of conformation. Heteroepitaxy is a deposition method by which a film or layer is deposited on a substrate of dissimilar composition.

Semiconductor companies are moving to the fabless model mainly to reduce overhead expenses related to the operation and maintenance of foundries. Most of these companies are concentrating on the design and development of their solutions and are subcontracting their fabrication and other foundry-related activities to specialized companies. Due to this, the ratio between foundries and fabless companies is 1:11 in the global semiconductor market. Companies are also considering M&A to increase their production facilities and market shares.

According to the report, the ever-increasing features and applications of smart devices such as smartphones and notebooks have created the need for high-performance semiconductor devices. Due to this, semiconductor manufacturers have increased the use of epitaxial deposition on the wafer over the last decade. The deposited layers are designed to have different compositional and electrical properties from the underlying wafer that can be adjusted according to the requirements of semiconductor devices.

Further, the report states that a challenge in epitaxial deposition is the need to inspect the thin-layered film at regular intervals to determine the presence of impurities such as particles, spikes, scratches, pits, and haze.

The report covers the present scenario and the growth prospects of the global epitaxy deposition market for the period 2016-2020. It covers the major end-user segments - foundries, memory manufacturers, and integrated device manufacturers (IDMs) - that implement epitaxy deposition technology to manufacture semiconductor chips. The report also includes a discussion of the key vendors operating in this market.

Key vendors

- Applied Materials, Inc. - ASM International - Hitachi Kokusai Electric Inc. - LAM RESEARCH CORPORATION - Tokyo Electron Limited

Other prominent vendors

- AIXTRON - Canon Anelva Corporation - IQE - Veeco Instruments

Key Topics Covered:

Part 01: Executive summary

Part 02: Scope of the report

Part 03: Market research methodology

Part 04: Introduction

Part 05: Technology landscape

Part 06: Market landscape

Part 07: Market segmentation by application

Part 08: Geographical segmentation

Part 09: Market drivers

Part 10: Impact of drivers

Part 11: Market challenges

Part 12: Impact of drivers and challenges

Part 13: Market trends

Part 14: Vendor landscape

Part 15: Appendix

For more information visit http://www.researchandmarkets.com/research/875lgj/global_epitaxy

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SOURCE Research and Markets