Chemical mechanical planarization (CMP) is a very important process in semiconductor manufacturing. The combination of mechanical abrasion and chemical etching enable polishing and flattening of wafers before the photolithography stage. This helps in avoiding the depth of field issues during illumination.
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
2.1 Introduction 2.2 Market Opportunities
Chapter 3 Planarization Methods
3.1 Need for Planarity 3.2 Applications 3.3 Planarization Techniques 3.4 CMP