DUBLIN, Oct. 12, 2015 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/8vfddg/camera_modules) has announced the addition of the "Camera Modules Market by Component (Image Sensor, Lens Module), Process (Flip-Chip), Pixel, Application (Consumer Electronics, Security & Surveillance, Automotive, Aerospace & Defense, Industrial), and Geography - Global Forecast to 2020 " report to their offering.

The camera modules market has been gaining momentum in the past few years because of the increasing demand for consumer electronics devices such as smartphones, tablet PCs, digital cameras, and others across all nations. The growth of this market is driven by the increasing trend of sharing images and videos using advanced media-sharing technologies which are the major aspect of social networking on a global basis within the smartphone and multimedia tablet ecosystem.

Also, the enhancement in the image resolution of sensors along with the technological advancements in camera modules components and design is driving the camera modules market. Moreover, the growing market for advanced driver assistance systems (ADAS) in the automotive sector is boosting the demand for image sensors, and in turn, camera modules. However, the high power consumption of CCD image sensors, and the heavy maintenance and high cost of camera modules are some of the factors restraining the growth of the global camera modules market.

Image sensor and lens module are the main components of a camera module. Image sensor is an electronic photosensitive device which is used to convert an optical image into an electronic signal. It consists of millions of photodiodes and acts as an image receiver in digital imaging equipment. It is widely used in digital cameras, camera modules, and other imaging devices. Analog sensors such as video tubes have replaced mostly by CCD (Charge-Coupled Device) and CMOS (Complementary Metal-Oxide-Semiconductor) image sensors.

Currently, majority of the requirement of image sensors is met by CMOS image sensor, while CCD image sensor is used especially for high-end applications. CMOS image sensors are preferred over CCD image sensors owing to their low power consumption, ease of integration, faster frame rate, and lower manufacturing cost. The lens module selects the quality of light incident on the image sensor and is thus responsible for the overall quality of the final output image.

Camera modules use a wide range of assembly technologies. The imager die can be mounted on either COB or flip-chip packages. Flip-chip camera modules are generally smaller than COB camera modules, but require higher-precision packaging technologies. Flip-chip camera modules require additional assembly steps and specialized equipment during the manufacturing process, which is not only time-consuming, but also makes flip-chip cameras more expensive.

Some of the emerging trends in the this market include increasing the resolution and complexity of image sensors for better image quality, increased application of camera modules in machine vision, growth in 4K pixel, (4096 x 2160) and ultra HD technologies, and growing use of camera modules in ADAS systems among others.

The market for camera modules in APAC is expected to grow at the highest CAGR of 12.1% between 2015 and 2020 to reach USD 15.48 Billion by 2020. The Asia-Pacific market of camera modules is growing rapidly as most of the camera modules manufacturers are located in APAC. Most of the demand for camera modules in APAC region is from the consumer electronics application including smartphones, tablet PCs, cameras, and others. With the inclusion of secondary cameras in smartphones, the demand for camera modules is expected to grow further. In addition, the development of advanced driver assistance systems (ADAS) for automotive application is also expected to boost the demand for camera modules in APAC.

This report estimates the camera modules market size and forecasts the same for the major regions ,namely, North America, Europe, Asia-Pacific, and Rest of the World. It also analyzes the trends in the global camera modules market. The report further profiles the top 10 companies present worldwide in this market, along with their recent activities such as mergers & acquisitions, collaborations, joint ventures, and new product developments.

This report describes the market trends and challenges pertaining to the global camera modules market and forecasts the market till 2020, on the basis of component, process, pixel, application, and geography. The report also features the detailed competitive landscape by identifying the key players along with their in-depth market share analysis in the global camera modules market. The sections and subsegments in the report also analyze the drivers, restraints, opportunities, and challenges in the market and the current market trends that are expected to have an impact on the global camera modules market.

Companies Mentioned

- Chicony Electronics Co., Ltd - Cowell E Holdings Inc. - Foxconn Electronics Inc. - LG Electronics Inc. - Lite-On Technology Corporation - Partron Co., Ltd - Samsung Electro-Mechanics Co., Ltd. - Sharp Corporation - Sunny Optical Technology (Group) Company Limited - Toshiba Corporation

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Laura Wood, +353-1-481-1716, press@researchandmarkets.net

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SOURCE Research and Markets