Global Advanced IC Packaging Technologies, Materials and Markets Report 2017-2021

DUBLIN, September 26, 2017 /PRNewswire/ --

The "Advanced IC Packaging Technologies, Materials and Markets - 2017 Edition" report has been added to Research and Markets' offering.

Advanced IC Packaging Technologies, Materials and Markets, 2017 Edition

reveals the latest technology and market trends in the IC packaging industry by focusing on the most advanced packaging products and solutions-those critical to success in developing cutting-edge products and in maintaining technological leadership. Every market or application segment discussed in the report includes quantitative analysis based on the most current historical years, 2015 and 2016, as well as forecasts from 2017 through 2021. Each of the six chapters examines the market from a different perspective.

The demand for consumer electronics and mobile communications devices that keep us connected is driving electronics manufacturers to deliver ever-more compact and portable products. Today's users ask for solutions that deliver more functionality, added performance, higher speed, and smaller form factors. Software systems and billions of networked devices are rapidly coalescing into a vast Internet of Things.

All of these forces are driving semiconductor companies to develop new advanced IC packaging technologies to provide greater silicon integration in increasingly miniaturized packages. The last decade has seen an explosion of new products including fan-out wafer-level packaging (FOWLPs), stacked IC packages and complex system-in-packages (SiPs), as well as advances in package substrates, flip chip interconnection and through-silicon vias. All these advances are enabling significant improvements in packaging density and opening new market opportunities for manufacturers.

Report Coverage:

• Fan-out WLPs
• Multi-row QFNs
• Interconnection Technologies
• Through-Silicon Vias (TSV)
• 2.5D and 3D Integration
• Stacked Packages
• System-in-Package

Report Highlights:

• Industry Outlook
• Market Analysis and Forecasts, 2015-2021
• Multichip Packaging Technology Trends
• Key Application Forecasts
• Company Profiles

Key Topics Covered:

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Overview of Worldwide IC Packaging Markets
3.1 Chapter Overview
3.2 IC Packaging Families
3.3 IC Packaging Market, Unit and Revenue Forecasts
Covers: Worldwide IC Packaging by I/O Count and by Device Type
3.4 Key Applications Market for IC Devices
Includes: Cellular Handsets, Tablets, PCs, Servers, Workstations, Set-Top Boxes, and others
3.5 Industry Trends Driving the Semiconductor Sector

Chapter 4: Advanced Single Chip IC Packaging
4.1 Chapter Overview
Covers: Total by Major Market Segments, Forecasts of the Advanced IC Packaging Markets
4.2 Fan-Out Wafer Level Packages
Covers: Market Overview, Trends and Forecasts
4.3 Multi-Row QFN Packages
Covers: Market Overview, Trends and Forecasts
4.4 Overview of Multichip Packaging Technology
Covers: Types of Multichip Packages, Benefits and Shortcomings, Packaging Challenges and Solutions, Wafer Thinning and MCP Market Trends/Forecasts
4.5 Stacked Multichip Packaging Market Segments
Covers: Market Trends and Forecasts for Stacked TSOPs, Stacked QFNs, Stacked FBGAs, Stacked WLPs
4.6 System-in-Packaging Market Overview
Covers: Types of SiPs, Key Features, SiPs vs. SoCs, Challenges, Market Trends and Forecasts for total Market Segment, Package-on-Packages, Package-in-Packages, Multichip Modules, Stacked WLPS in SiPs
4.7 Substrates
Covers: Market Overview, Market Trends and Forecasts by Materials, High Density Interconnect, Embedded Components

Chapter 5: Interconnection Technologies and Solutions
5.1 Interconnection Techniques Overview
5.2 Wire Bonding
5.2.1 Wire Bonding Methods
5.2.2 Wire Materials
5.2.3 Wire Bonding Material Trends and Forecasts
5.3 Flip Chip
5.3.1 The Flip Chip Process
5.3.2 Flip Chip Packaging Market Trends and Forecasts
5.3.3 Flip Chip Package Device Market Trends and Forecasts
5.3.4 Bare Die Flip Chip Market Trends and Forecasts
5.4 Through-Silicon Vias
5.4.1 The Case for TSV Integration
5.4.2 Status of TSV Interconnection
5.4.3 Interposers and 2.5D
5.4.4 Forecasts for TSV by Market Segment

Chapter 6: Advanced IC Packaging Company Profiles
6.1 Chapter Overview
6.2 3D Plus, Inc.
6.3 Advanced Semiconductor Engineering, Inc.
6.4 Amkor Technology, Inc.
6.5 Carsem, Inc.
6.6 ChipMOS Technologies (Bermuda), Ltd.
6.7 CONNECTEC Japan Corporation
6.8 Deca Technologies
6.9 FlipChip International, LLC
6.10 HANA Micron Co., Ltd.
6.11 Interconnect Systems Inc. (ISI)
6.12 NANIUM, S.A.
6.13 Palomar Technologies
6.14 Powertech Technology, Inc.
6.15 Shinko Electric Industries Co, Ltd
6.16 Signetics Corporation
6.17 Siliconware Precision Industries Co.
6.18 SPEL Semiconductor, Ltd.
6.19 STATS ChipPAC, Ltd
6.20 Taiwan Semiconductor Manufacturing Co. Ltd.
6.21 United Test and Assembly Center, Ltd.
6.22 Xintec, Inc.

For more information about this report visit https://www.researchandmarkets.com/research/zkdpvk/advanced_ic

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