A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment.
The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems.
The analysts forecast the Global 3D IC market to grow at a CAGR of 18.4 percent over the period 2013-2018.
This report covers the present scenario and the growth prospects of the Global 3D IC market for the period 2014-2018. The report includes the overall revenue generated from the sales of 3D ICs. The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology.
The report also presents the vendor landscape and a corresponding detailed analysis of the top four vendors in the Global 3D IC market. In addition, the report discusses the major drivers that influence the growth of the Global 3D IC market. It also outlines the challenges faced by the vendors and the market at large, as well as the key trends that are emerging in the market.
One of the major trends upcoming in this market is the multi-chip packaging of 3D ICs, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs.
According to the report, one of the major growth drivers in this market is an increase in demand for 3D ICs in memory products such as flash memory and DRAM. 3D ICs improve the performance and reliability of memory products and also reduce their cost and size.
Further, the report states that one of the major challenges that the market faces is thermal conductivity issues associated with 3D ICs. The thermal conductivity of 3D ICs is low, which adversely affects the performance and durability of end-products.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Key Topics Covered:
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
04. Market Research Methodology
06. Market Landscape
07. Market Segmentation by Product
08. Market Segmentation by End-users
09. Geographical Segmentation
10. Key Leading Countries
11. Buying Criteria
12. Market Growth Drivers
13. Drivers and their Impact
14. Market Challenges
15. Impact of Drivers and Challenges
16. Market Trends
17. Trends and their Impact
18. Vendor Landscape
19. Key Vendor Analysis
20. Market Summary
21. Other Reports in this Series
- Advanced Semiconductor Engineering
- Samsung Electronics
- Taiwan Semiconductor Manufacturing
- 3M Company
- Micron Technology
- STATS ChipPAC
- United Microelectronics
For more information visit http://www.researchandmarkets.com/research/kpcrs9/global_3d_ic
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SOURCE Research and Markets