DUBLIN, Feb. 18, 2016 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/79pv4j/finfet_technology) has announced the addition of the "FinFET Technology Market by Technology (22nm, 20nm, 16nm, 14nm, 10nm, 7nm), Product (CPU, SoC, FPGA, GPU, MCU, and Network Processor), End-User (Smartphones, Computers & Tablets, Wearables, and Automotive) and Geography - Global Forecast to 2022" report to their offering.
The scope of this report covers the FinFET technology market by technology, product, end user, and region. The 22nm process node is expected to hold the largest market share of the global FinFET technology market. The 7nm FinFET process is expected be the fastest-growing technology to manufacture chips in various applications during the forecast period.
On the basis of products, the FinFET technology market is segmented into CPU, SoC, FPGA, GPU, MCU, and network processor. CPUs led the market in 2015; however, the market for GPUs is expected to grow at highest CAGR during the forecast period. Application processors in smartphones have the same functionalities as that of CPUs. Samsung (South Korea) led the market for application processors in 2015 by introducing its Exynos Octa 7 chips manufactured using the 14nm FinFET technology. In 2016, the next chip in the Exynos series (Exynos Octa 8) is expected to power the smartphones with more functionalities and improved performance.
The market in APAC is estimated to grow rapidly between 2016 and 2022. The growth in the demand for high-end smartphones in this region has driven the FinFET technology market. Samsung (South Korea) is the first company to manufacture chips using the technology at 14nm process. Exynos Octa 7 is manufactured using the 14nm process which is used in Samsung Galaxy S6 and S6 edge phones. Also, the presence of two key players- TSMC, Ltd. (Taiwan) and Samsung (South Korea) is responsible for the popularity of FinFET technology in this region. TSMC (Taiwan) and Samsung (South Korea) manufactured the A9 processor for Apple (U.S.) using FinFET technology.
Conversely, factors inhibiting the market growth are the complexity in the FinFET design process. The major challenge for the adoption of FinFET technology is low costs of wafers and gate cost of FD-SOIs. The cost of processed wafer and gate in SOIs is lesser compared to bulk CMOS and FinFETs, and the considerations include processing and mask steps, tool depreciation, die shrink area, and parametric yield. The low cost of FDSOI is a one of the major challenges for the FinFET technology market as there is not much difference between the performance of these two technologies; the former provides equal or better power consumption and at a lower cost.
Major players in this market are Intel (U.S.), Samsung (South Korea), GlobalFoundries (U.S.), and TSMC (Taiwan).
Scope of the Report
The research report segments the FinFET technology market to following sub-segments:
- 22nm - 20nm - 16nm - 14nm - 10nm - 7nm
- CPU - SoC - FPGA - GPU - MCU - Network Processor
By End User:
- Smartphones - Computers and Tablets - Wearables - High-End Networks - Automotive
- Arm Holdings PLC. - Globalfoundries - Intel Corporation - Mediatek, Inc. - Qualcomm Incorporated - Samsung Electronics Corporation, Ltd. - Semiconductor Manufacturing International Corp. - Taiwan Semiconductor Manufacturing Company Limited (TSMC Ltd.) - United Microelectronics Corporation - Xilinx Inc.
For more information visit http://www.researchandmarkets.com/research/79pv4j/finfet_technology
Laura Wood , +353-1-481-1716, email@example.com
SOURCE Research and Markets