Fan-Out and Embedded Die: Global Technologies & Market Trends 2015

DUBLIN, June 04, 2015 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/n55fpm/fanout_and) has announced the addition of the "Fan-Out and Embedded Die: Technologies & Market Trends" report to their offering.

Today, the market is worth almost $200M and we anticipate 30% CAGR is in coming years
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications - essentially single die packages for cell phone baseband chips - reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology.

It faced strong competition from other packages such as wafer-level chip scale packaging (WLCSP) in 2013/2014. Intel Mobile also backed off from the technology, and the main manufacturers reduced their prices in 2014, creating a transition phase with low market growth.

One of the key factors driving this is the arrival of 2nd generation FOWLP. More customers are also being convinced, a wider range of potential applications reached, and technology qualifications started during the transition phase completed by strong fab-less players.

Key Features Of The Report:

For both Fan-Out and Embedded Die technologies and markets:

- Drivers and challenges for technology adoption

- Product and technology descriptions and analysis per player

- Detailed supply chain explanation

- Commercialization status with player strategies and status

- Market forecasts in volume and revenue, split per application and per end-market

- Equipment and materials challenges

- Panel/wafer size evolution roadmap

Key Topics Covered:

1. Report scope & definitions
- Scope of the report
- Glossary

2. Executive summary

3. Advanced packaging context

4. Fan-Out platform
- Motivations and drivers
- Products and technologies
- Products available
- Roadmaps
- Supply chain for FOWLP
- Players and positioning within the supply chain
- FOWLP commercialization status
- Market forecasts
- Global market in revenues, wafers and packages
- Split per application and end-markets
- Equipment & materials
- Improvement of materials
- Panel for FOWLP status

5. Embedded Die in substrates packaging> Motivations and drivers
- Products and technologies
- Products available
- Roadmaps
- Supply chain for Embedded Die packaging
- Players and positioning within the supply chain
- Embedded Die packaging commercialization status
- Market forecasts
- Global market in revenues and packages
- Split per application and end-markets
- Equipment & materials
- Improvement of materials
- Panel for Embedded Die packaging status

6. Conclusions and perspectives

Companies Mentioned

- 3D-Plus
- ADL Engineering
- Amkor
- AMS
- Analog Devices
- AT&S
- ASE
- ASM
- Broadcom
- Bosch
- Casio Micronics
- CEA-Leti
- Compass Technology
- CSR
- Datacon
- Daeduck
- Denso
- Dialog Semiconductor
- Dow Corning
- DuPont Electronics
- Dyconex
- Epcos TDK
- EVGroup
- Flip-chip International
- Fraunhofer-IZM
- Freescale
- Fujitsu
- Ibiden
- Imbera
- IME
- IMEC
- Infineon
- Micron
- Murata
- Nagase ChemteX
- NANIUM
- Nitto Denko
- Nokia
- NXP
- Panasonic
- Qualcomm
- Renesas
- Samsung
- SEMCO Shinko Electric
- SPIL
- STATS ChipPAC
- STMicroelectronics
- SPTS
- SMIC
- Shin-Etsu
- SÜSS Microtec
- Taiyo Yuden
- TDK
- Tessera
- Texas Instruments
- Tong Hsing
- Toray Chemical
- Toray Engineering
- Toshiba
- Towa
- Triquint
- Unimicron
- UTAC
- Wolfson Microelectronics

For more information visit http://www.researchandmarkets.com/research/n55fpm/fanout_and

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net