Equipment & Materials for 3DIC & Wafer-Level Packaging Applications

DUBLIN, Jan. 02, 2015 /PRNewswire/ --Research and Markets

(http://www.researchandmarkets.com/research/t4dphj/equipment_and) has announced the addition of the "Equipment & Materials for 3DIC & Wafer-Level Packaging Applications " report to their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769)

Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modificationequipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year.

Key Topics Covered:

1. Report scope & definitions

2. Glossary

3. Companies cited in this report

4. Definitions, limitations & methodology

5. Analysis comparison: 2011 vs. 2014

6. Who should be interested in this report?

7. Executive summary

8. Equipment market forecast for 3D & WLP

9. 3DIC & WLP technologies process flows & manufacturing trends analysis

10. Conclusions & perspectives

Companies Mentioned:

• ALSI
• AML
• ASM Pacific Technologies
• AST (Samurai)
• ATMI
• ATOTECH
• AZ Electronic Materials
• Alchimer
• America Furukawa Inc.
• Anji Microelectronics
• Applied Materials
• Asahi Kasei E-Materials Corporation
• Auros Tech
• Austin American Technology Corp
• Brewer Science
• Bruker AXS
• CAMTEK USA
• CHAPMAN
• CSM Instruments
• Cabot electronics
• Canon ANELVA
• Cascade Microtech
• Chomerics (Parker Hannifin Corp.)
• Corning
• Corning Incorporated
• Cyantek
• Cyber-Technologies
• DJ DevCorp
• DYNATEX International
• Dai Nippon SCREEN
• Datacon Technology GmbH (BESI)
• Daxin Materials Corporation
• Denka
• Disco Corporation
• Dongjin Semichem Co.
• Dow Corning Corporation
• Dow Electronic Materials
• DuPont Electronic Technologies
• Dynaloy (Eastman Chemical Company)
• EBARA Technologies Corp.
• ECI Technology
• EEJA
• ENF Technology Co. Ltd
• ERS electronic GmbH
• ESEC AG
• ESI
• EV Group
• EXCICO
• Eastman Chemical
• Ebina Denka
• Electroglas Inc
• Enterprix
• Enthone (Cookson Electronics)
• Epoxy Technology Inc.
• Etched in Time Inc.
• Evest Corp.
• Exelsius
• FASSE CO. LTD.
• FOGALE Nanotech
• FSI International
• FUJIFILM Electronic Materials
• Fico molding (BESI)
• Finetech
• Frontier Semiconductor
• Frt Of America
• Fuji Polymers
• GE Sensing & Inspection Technologies
• GPD Global
• Gore
• HD MicroSystems
• HORIBA Semiconductor
• HamaTech APE GmbH & Co. KG
• Hamamatsu
• Henkel Corporation
• Heraeus GmbH
• Hesse & Knipps
• Hitachi Chemical Co. Ltd.
• Hitachi High Technologies Corporation
• Honeywell Electronic Materials
• Inc
• LORD Corporation
• Loadpoint
• MECO
• MEMC Electronic Materials Inc.
• MSG Lithoglas AG MTK Co Ltd.
• Mapper Lithography
• Materion
• Mattson Technology
• Mechatronic Systemtechnik
• Metryx
• MicroChem
• MicroFab Technologies Inc
• Micronic Laser Systems AB
• Micronics Japan Co.
• Mitshubishi Gas Chemical
• Mitsubishi Chemical Corporation
• Mitsubishi Electric
• Mitsubishi Heavy Industry (MHI)
• Mitsubishi Materials
• Mitsubishi Materials Corporation
• Mitsui Chemicals
• Momentive Performance Material Inc.
• Mühlbauer
• NANOPLAS
• NEC / SCHOTT
• NEXX Systems
• NOVELLUS
• Nagase & Co. Ltd.
• Namics
• Nanda Tech GmbH
• Nanovea
• Newport
• Nikko Metal
• Nikon Corporation
• Nippon Electric Glass Co. Ltd. NEG
• Nippon Kayaku Co. Ltd.
• Nippon Sheet Glass Co. Ltd. NSG
• Nissan Chemical Industries
• Nitta Haas Inc.
• Nitto Denko Corporation
• Norcom Systems Inc
• Nordson ASYMTEK Inc.
• Nordson March
• Nordson dage
• OM Group Ultra Pure Chemicals Pte. Ltd.
• OPµS
• Oerlikon
• Okmetic
• Orbotech Ltd.
• Oxford Instrument
• PANASONIC Factory Solutions
• PVA TePla AG
• Palomar Technologies Inc.
• Panasonic Denko
• Philips Applied Technologies
• Plan Optik AG GmbH
• Polymatech
• Praxair.com
• Promerus LLC
• Protavic America Inc.
• REC Silicon
• RENA GmbH
• Ramgraber GmbH
• Replisaurus Technologies
• Ricmar Technology GmbH
• Rorze
• Rudolph Technologies
• SAMCO Inc.
• SCS Speciality Coating Systems
• SET Smart Equipment Technology
• SHINKAWA LTD.
• SOITEC
• SONOSCAN
• SPP (Sumitomo Precision Products Co. Ltd.)
• SPTS
• SSEC Solid State Equipment Corporation
• STIL SA
• SUSS Microtec
• Saint-Gobain
• Schmoll Machinen
• Schott AG
• Sekisui Chemical Co. Ltd.
• Semiconductor Technologies & Instruments (ASTI)
• Semprius
• Senju Metal Industry Co. Ltd.
• Shibaura Mechatronics Corporation
• Shin-Etsu MicroSi Inc
• Siconnex
• Silecs
• Singulus
• Sokudo Co. Ltd.
• SolMateS
• Solvay
• Starfire Systems Inc.
• Strasbaugh
• Sumco Corporation
• Sumitomo Bakelite
• Sumitomo Chemicals
• Surface Science Integartion
• TEGAL
• TEL (Tokyo Electron LTD.)
• TOK (Tokyo Ohka Kogyo Co. Ltd.)
• TOWA Corporation
• TRESKY
• TRIOPTICS
• Takatori Ltd.
• Tamar Technology
• Tamarack Scientific
• Tango Systems
• Tecnisco
• Teradyne
• Thin materials AG
• Timbre Technologies
• Toray Engineering Co. Ltd.
• Toray Industries
• ULVAC Inc.
• Ultraspray
• Ultratech
• Umicore
• Uyemura Co. Ltd.
• Uyemura International Corporation
• Veeco
• Zeon Chemicals L.P.
• Zygo Corporation Inc
• hin-Etsu Chemical Co. Ltd.
• nScrypt Inc.
• picoDRILL
• rasco

For more information visit http://www.researchandmarkets.com/research/t4dphj/equipment_and

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