Bosch Sensortec BME280 - Reverse Costing Analysis

DUBLIN, June 22, 2015 /PRNewswire/ --

Research and Markets(http://www.researchandmarkets.com/research/ttn6d5/bosch_sensortec) has announced the addition of the "Bosch Sensortec BME280 - Reverse Costing Analysis" report to their offering.

Bosch BME280 environmental sensor is the evolution of BMP280 pressure sensor. Assembled in a 8-pins LGA 2.5 x 2.5 x 0.93mm package, the BME280 is a digital humidity, pressure and temperature sensor equipped with two MEMS dies and an amplification ASIC. It is designed by CMOS process and it has operating ranges of -40+85°C, 0100 % relative humidity and 3001100 hPa.

The MEMS pressure sensor is manufactured with Bosch APSM process with the flexible pressure membrane and temperature diodes on Si substrate. The relative humidity sensor presents an innovative resistive measurement technology which allows a very fast and precise response.

The report presents a deep technological and cost analysis of BME280 and a technical comparison with BMP280 MEMS and ASIC.

Key Topics Covered:

1. Glossary

2. Overview/Introduction , Companies Profile

3. Physical Analysis

4. Package
- Package Views & Dimensions
- Package Opening
- Wire bonding Proces
- Package Cross-Section
- ASIC Die
- View, Dimensions & Marking
- ASIC Delayering
- ASIC main blocks identification
- ASIC Proces
- ASIC Die Cross-Section
- Pressure & Humidity Die
- View, Dimensions & Marking
- MEMS Pressure Sensing Area
- MEMS Humidity Sensing Area
- MEMS Pressure Cross-Section: MEMS
- MEMS Humidity Cross-Section
- MEMSs processes

5. Comparison with BMP280 pressure sensor

6. Manufacturing Process Flow

7. ASIC Front-End Process
- MEMS Pressure Process Flow
- MEMS humidity Process Flow
- Wafer Fabrication Units
- Packaging Process Flow & Assembly Unit

8. Cost Analysis

9. Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Front-End Cost
- MEMS Pressure Front-End Cost
- MEMS Pressure Back-End 0 : Probe Test & Dicing
- MEMS HumidityWafer & Die Cost
- MEMS HumidityFront-End Cost
- MEMS Humidity Back-End 0 : Probe Test & Dicing
- MEMS Pressure Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test & Calibration Cost
- BME280 Component Cost

10. Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/ttn6d5/bosch_sensortec

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net