PUNE, India, October 8, 2015 /PRNewswire/ --
According to a new market research report "Liquid Encapsulation Materials Market by Material (Epoxy Resin & Epoxy-Modified Resin), Product (Integrated Circuits, Optoelectronics & Sensors), Application (Automotive, Telecommunication & Electronics), and Geography - Global Forecast to 2020", published by MarketsandMarkets, the market is expected to reach USD 1,397.46 Million by 2020, at an estimated CAGR of 6.7% between 2015 and 2020.
Browse 76 market data Tables and 105 Figures spread through 187 Pages and in-depth TOC on "Liquid Encapsulation Materials Market"
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The encapsulation technique is primarily used in various industry verticals such as food industry, healthcare, automotive, and electronics among others. Liquid encapsulation in semiconductor is a process which helps in the smooth working of a circuit without affecting its physical characteristics.
Liquid encapsulation also protects the circuits from temperature effects and also helps to overcome the threat of misconnection within the components. The liquid encapsulation material market is currently in a nascent stage for the semiconductor & electronics industry, where this technique is used in various products such as integrated circuits, optoelectronics, discrete semiconductor, and sensors.
According to SEMI, liquid encapsulation materials accounted for ~2% of the market share of the global semiconductor materials market in 2014.
The growing complexity and functionality of electronics devices and the trend of miniaturization in devices are the major drivers behind the growing importance of the liquid encapsulation technique in the semiconductor industry. Electronics devices are usually made of small components and small structures which have to be arranged properly and accurately. Any misconnection can result in the faulty functioning of the device. The liquid encapsulation technique plays a vital role in this by creating a layer on the structure of the device which ensures that all components are in place.
The global liquid encapsulation materials market is projected to grow at a CAGR of 6.7% between 2015 and 2020 from an estimated value of USD 1,011.97 Million in 2015 and is projected to reach USD 1,397.46 Million by 2020.
The global liquid encapsulation materials market describes the market trends, drivers, and challenges with respect to the liquid encapsulation materials and forecasts the market till 2020, on the basis of material, technology, product, and geography. It provides a bird's eye view of the market across various regions such as the Americas, Europe, APAC, and RoW.
APAC is the largest market for global liquid encapsulation materials and held the major market share in 2014, with Taiwan occupying the largest market share.
APAC is estimated to account for more than 65% of the total market share till 2020. It is projected to be the fastest-growing region between 2015 and 2020 for the market owing to the growing demand from sensors devices, wireless technologies, and optoelectronics segment. The market for global liquid encapsulation materials in APAC is expected to grow at the highest CAGR of 7.6% between 2015 and 2020.
The competitive landscape of the market presents valuable insights into the various players in the global liquid encapsulation materials market. The global liquid encapsulation materials market report profiles the 12 promising players in the market and further explains their business overview, product portfolio, recent developments, and key strategies. The market is witnessing new product developments and mergers & acquisitions across the value chain between companies.
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The major players in the global liquid encapsulation materials market are Shin-Etsu Chemical Co., Ltd. (Japan), Sumitomo Bakelite Co., Ltd. (Japan), Hitachi Chemical Co. Ltd. (Japan), Henkel AG and Co. KGaA (Germany), Kyocera Corporation (Japan), Nagase & Co., Ltd. (Japan), Nitto Denko Corporation (Japan), Panasonic Corporation (Japan), BASF Se (Germany), Sanyu Rec Co. Ltd. (Japan), Resin Technical Systems (U.K.), and Epic Resins (U.S.) among others.
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