Thermosetting Moulding Materials for Electronics Market is Projected to Expand at a CAGR of 5.0% During 2018-2026- Persistence Market Research

Persistence Market Research delivers key insights on the global Thermosetting Resin Moulding Materials for Electronics market in its report entitled 'Thermosetting Resin Mouldingb Materials for Electronics Market: Global Industry Analysis 2013 - 2017 and Forecast 2018-2026.' The long-term outlook on the global Thermosetting Resin Moulding Materials for Electronics market will grow significantly at a CAGR of 5.0% during the forecast period 2018 - 2026 in terms of value. In the report, the annual consumption of Thermosetting Resin Moulding Materials for Electronics is provided in terms of tons. According to the application of Thermosetting Resin Moulding Materials for Electronics, epoxy segment is expected to register a healthy growth during the forecast period. Based on end use, Consumer Electronics segment is expected to witness a significant CAGR in terms of value and value during the forecast period.

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Estimated sales of Thermosetting Resin Moulding Materials for Electronics in global market is valued to be US$ 1,139.3 Mn by the end of 2018, witnessing a CAGR growth of 5.0% over the year 2026. North America, Mainland China and Japan are collectively expected to account for major share in the global Thermosetting Resin Moulding Materials for Electronics market by the end of 2018 while South East Asia & Pacific (SEAP) is expected to emerge as attractive Thermosetting Resin Moulding Materials for Electronics market during the forecast period.

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Global Thermosetting Resin Moulding Materials for Electronics Market: Dynamics 

The semiconductor industry has multiple uses of Thermosetting Resin Moulding Materials for Electronics and its associated derivatives. The Thermosetting Resin Moulding Materials for Electronics are the starting material for the manufacturing of fillers in the semiconductor industry as a packaging material for the encapsulation of microelectronics devices. Furthermore, rising population and their purchasing power will promote demand for consumer electronics, which in turn, will drive the market of Thermosetting Resin Moulding Materials for Electronics market.

The Thermosetting Resin Moulding Materials for Electronics market consist of High Purity Quartz (Lower Purity Grade, HPQ Powder, Grade I HPQ, Grade II HPQ and Grade III HPQ) and Competitive Products (Fumed Silica, Spherulised Fused Silica, Synthetic Silica, Crystal Silica and Ti, Al, Zr, Ferrite Powders). The application in epoxy among other Thermosetting Resin Moulding Materials for Electronics is gaining popularity for the manufacturing of lightweight components for commercial and military aircrafts that has led to lower fuel consumption, lower emissions, reduction in overall cost and improved vehicle mechanical strength. Owing to their sheer advantages of Thermosetting Resin Moulding Materials for Electronics use over conventional bulbs will continue to increase their penetration in the automotive and aerospace sectors.

Thermosetting Moulding Materials Electronics Market : Segmentation by Base Material - High Purity Quartz (HPQ) , Lower Purity Grades, HPQ Powder, Grade I HPQ, Grade II HPQ, Grade III HPQ, Competitive Products , Fumed Silica, Spherulised Fused Silica and others; by application - Epoxy, Polyester, Polyurethane, Polyimide, Formaldehyde, and melamine formaldehyde, Bakelite, Others: https://www.persistencemarketresearch.com/market-research/thermosetting-moulding-materials-electronics-market.asp

Global Thermosetting Resin Moulding Materials for Electronics Market: Forecast 

On the basis of application, market insights suggest that the Epoxy segment will continue to dominate the Thermosetting Resin Moulding Materials for Electronics market during the forecast period. On the basis of end-use, the consumer electronics segment followed by automotive segment is projected to dominate the Thermosetting Resin Moulding Materials for Electronics market during the forecast period. In 2017, the consumer electronics segment accounted for over two third of the Thermosetting Resin Moulding Materials for Electronics market share. In terms of volume, the automotive segment is expected to grow at a CAGR of 4.1% over the forecast period.

North America, China and Europe Thermosetting Resin Moulding Materials for Electronics market will continue to dominate the global Thermosetting Resin Moulding Materials for Electronics market during the forecast period. North America and China are estimated to grow with CAGR of 3.7% and 5.5% respectively over the forecast period. Japan will also hold major revenue share in the global Thermosetting Resin Moulding Materials for Electronics market over the forecast period.

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Global Thermosetting Resin Moulding Materials for Electronics Market: Competitive Landscape 

Some of the key market participants included in the Global Thermosetting Resin Moulding Materials for Electronics market report are: Unimin-Sibelco, Samsung SDI Co. Ltd., Golovach Quartz, Momentive,, The Quartz Corporation, Kyocera Chemical Corporation, Tosoh Corporation, ANZAPLAN GmbH, HPQ Silicon, Jiangsu Pacific Quartz Co.,Russian Quartz LLC -Kyshtym Mining -Sumitomo, Nordic Mining ASA, CB Minerals and others. The Global Thermosetting Resin Moulding Materials for Electronics Market is said to be consolidated in nature with the top three producers of Thermosetting Resin Moulding Materials for Electronics acquiring an aggregate market share of over 85%. Established supply chain infrastructure with raw material providers has been practiced by the Thermosetting Resin Moulding Materials for Electronics producers in order to gain easy access to the raw material at a low procurement cost which in turn has also enabled the companies to sell the final product at a competitive price incurring convenient profit margins per sales unit. Consolidation of sales footprint across the globe and continuous improvement in product innovation have been the key strategies of the Thermosetting Resin Moulding Materials for Electronics producers.

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