Research and Markets - Global 3D-Printed Metals Market Analysis 2016-2020 - Trends, Technologies & Opportunities Report - Key Vendors: General Electric, Siemens, Honeywell
DUBLIN, May 12, 2016 /PRNewswire/ --
Research and Markets has announced the addition of the "3D-Printed Metals: A Patent Landscape Analysis - 2016 " report to their offering.
This new report provides a full-scale assessment of the patent landscape for 3D-printed metals and answers important questions such as:
- What patents have been granted and what patent applications have been filed?
- What are the top cited patents?
- How many patents are being filed each year?
- Who are the most significant inventors, researchers and companies active in the field
- Which companies are making the earliest patent grants?
- What patent families are already claimed and where are the gaps in the IP landscape where new IP rights may be available?
- What is the geographic distribution and technological class distribution of these patents?
Metals-based 3D printing is one of the fastest growing sectors of the 3D printing business and this new report builds on SmarTech's broad knowledge and understanding of metals printing as well as extensive research into the related patent environment for 3D-printed metals.
This report will be required reading for IP professionals at firms supplying metals to the 3DP industry as well as those at 3D printing equipment and service companies. It is also aimed at patent attorneys, engineers, investment banks and others who need a comprehensive overview of 3D-printed metals activities.
This report is based on an extensive search of relevant patents and patent applications published after December 1, 1995 from the US and WO patent databases to identify a broad, yet relevant patent landscape related to metal powder materials used for 3D printing.
3D-Printed Metals: A Patent Landscape Analysis - 2016 also provides a strategic report containing insider perspective on the patent scene for 3D-printed metals and where it is headed. This part of the study also offers views on the possible directions that leading firms will take given their intellectual property position.
Companies Mentioned:
- Alstom
- Arcam
- ConforMIS
- EOS
- General Electric
- Honeywell
- Husky Injection Molding
- Materialise NV
- Panasonic/Matsushita
- Siemens
- The ExOne Company
- United Technologies Corporation
Report Structure:
Chapter One: Research Findings and Summary
Chapter Two: Active Universities
Chapter Three: Key Inventors
Chapter Four: Patent Trend
Chapter Five: Key Patents Based on Forward Citation
Chapter Six: Technology Analysis
Chapter Seven: Geographical Distribution
Chapter Eight: Granular Analysis
Chapter Nine: White Space Analysis
Chapter Ten: Commentary and Guidance
For more information visit http://www.researchandmarkets.com/research/tj7lcn/3dprinted
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