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Packaging Market For Compound Semiconductor to Reach $25.61 Billion, Globally, By 2027 at 10.4% CAGR: Allied Market Research

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Allied Market Research

11 Nov, 2020, 12:50 GMT

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Rise in demand for miniaturization of devices and enhanced system performances & optimization of compound semiconductor packaging fuel the growth of the packaging market for compound semiconductor.

PORTLAND, Ore., Nov. 11, 2020 /PRNewswire/ -- Allied Market Research published a new report, titled, "Packaging Market For Compound Semiconductor By Packaging Platform (Flip Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Application (CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum), and End User (Digital Economy, Industrial and Energy & Power, Defense/Security, Transport, Consumer Electronics, Healthcare, and Space): Global Opportunity Analysis and Industry Forecast, 2020–2027". According to the report, the global packaging market for compound semiconductor was estimated at $11.63 billion in 2019, and is expected to hit $25.61 billion by 2027, registering a CAGR of 10.4% from 2020 to 2027.

Drivers, Restraints and Opportunities

Rise in demand for miniaturization of devices, enhanced system performances & optimization of compound semiconductor packaging, and emerging trends toward semiconductor wafers in the automotive industry fuel the growth of the packaging market for compound semiconductor. On the other hand, high cost of compound semiconductor packaging impedes the growth to some extent. However, emerging usage of compound semiconductors in smart technologies and ongoing trends of fan-out wafer level packaging are expected to create multiple opportunities in the industry.

Download Sample Report (Get Full Insights in PDF - 205 Pages) @ https://www.alliedmarketresearch.com/request-sample/7561

Covid-19 Scenario:

  • The outbreak of the pandemic led to decline in demand for compound semiconductor from several industry verticals. Also, huge disruptions in the supply chain impacted the market negatively.
  • However, the government bodies have started easing off the existing regulations and the global market for compound semiconductor is expected to get back to its position soon.

The Flip Chip Segment to Dominate By 2027

Based on packaging platform, the flip chip segment accounted for more than half of the global packaging market for compound semiconductor in 2019 and is expected to retain its dominance by the end of 2027. Rise in need for circuit miniaturization and increase in trend of Internet of Things (IoT) drives the growth of the segment. The fan-out WLP segment, on the other hand, would grow at the fastest CAGR of 13.1% throughout the forecast period. This is because fan-out WLP is a highly efficient method of manufacturing and removes the size constraints of a standard procedure.

The CS Power Electronics Segment to Lead the Trail

Based on application, the CS power electronics segment contributed to nearly one-third of the global packaging market for compound semiconductor in 2019 and is projected to maintain the lion's share till 2027. Growth in demand for efficient energy management in high-voltage power electronics, such as solar inverters and hybrid vehicles, propels the need for incorporation of compound semiconductors such as SiC and GaN. This factor has boosted the segment growth.

At the same time, the CS sensing segment would register the fastest CAGR of 12.6% from 2020 to 2027. Semiconductor sensors are indispensable components in the future Internet of Things (IoT), robotics, industrial testing, spectroscopy, imaging and other applications. Thus, rise in adoption of wearable devices and various innovative applications in biomedical are projected to increase the demand for compound semiconductor packaging in sensing applications.

China Garnered the Highest Share in 2019

Based on geography, China held the major share in 2019, garnering nearly one-third of the global packaging market for compound semiconductor. This is due to the vast presence of fabrication facilities in the country and extensive research & development by the key players such as Amkor, Fujitsu amongst others. Simultaneously, the US would portray the fastest CAGR of 10.5% by 2027, due to growth in the semiconductor industry, paired with the rise in trends in data processing and power transmission.

Interested to Procure the Data? Inquire Here @ https://www.alliedmarketresearch.com/purchase-enquiry/7561

Frontrunners in the Industry

  • Taiwan Semiconductor Manufacturing Company
  • Jiangsu Changjiang Electronics Tech Co.
  • Amkor Technology
  • Fujitsu Limited
  • ASE Technology
  • KLA Corporation
  • Qorvo
  • Texas Instruments
  • Tokyo Electron Limited
  • Deca Technologies Inc.

Access AVENUE - A Subscription-Based Library (Premium On-Demand, Subscription-Based Pricing Model) @ https://www.alliedmarketresearch.com/library-access

Avenue is a user-based library of global market report database, provides comprehensive reports pertaining to the world's largest emerging markets. It further offers e-access to all the available industry reports just in a jiffy. By offering core business insights on the varied industries, economies, and end users worldwide, Avenue ensures that the registered members get an easy as well as single gateway to their all-inclusive requirements.

Avenue Library Subscription | Request For 14 Days Free Trial of Before Buying:
https://www.alliedmarketresearch.com/avenue/trial/starter

Similar Reports:

Advanced Packaging Market Anticipated to Grow $64.19 Billion By 2027

Wafer Level Packaging Market Expected to Reach $7.8 Billion By 2022

Epitaxial Wafer Market For Compound Semiconductor to Hit $7.27 Billion By 2027

3D Semiconductor Packaging Market Expected to Garner $8.9 Billion By 2022

Compound Semiconductor Market Estimated to Grow $212.9 Billion By 2027

Semiconductor IP Market Anticipated to Reach $5.70 Billion By 2024

Pre-Book Now with 10% Discount:

LED Packaging Market: Global Opportunity Analysis and Industry Forecast 2020-2027

Power Module Packaging Market: Global Opportunity Analysis and Industry Forecast 2020-2027

About Us:

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Portland, Oregon. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of "Market Research Reports" and "Business Intelligence Solutions." AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

Contact:
David Correa
5933 NE Win Sivers Drive
#205, Portland, OR 97220
United States
USA/Canada (Toll Free): 
1-800-792-5285, 1-503-894-6022, 1-503-446-1141
UK: +44-845-528-1300
Hong Kong: +852-301-84916
India (Pune): +91-20-66346060
Fax: +1(855)550-5975
help@alliedmarketresearch.com
Web: https://www.alliedmarketresearch.com 
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