DUBLIN, February 6, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/x4j479/invensense) has announced the addition of the "InvenSense MPU-6500 6-Axis MEMS IMU Reverse Costing Analysis" report to their offering. 

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The Smallest 6-Axis IMU (3-Axis Gyro + 3-Axis Accelero)
InvenSense's Second Generation 6-Axis Devices for Consumer Applications 

In a market very disputed with STMicroelectronics and Bosch, InvenSense is still at the leading edge technically by providing 6Axis IMU with a high level of integration.

With a package size of 3x3mm (45% footprint reduction compared to the previous generation), the MPU-6500 is the smallest 6-Axis IMU for consumer applications. 

This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction. 

This report will provides a complete teardown of the MEMS IMU with:

• Detailed photos
• Material analysis
• Schematic assembly description
• Manufacturing Process Flow
• In-depth manufacturing cost analysis
• Supply chain evaluation
• Selling price estimation

Key Topics Covered: 

Glossary

Overview/Introduction 

• Executive Summary
• Reverse Costing Methodology

InvenSense Company Profile 

Physical Analysis 

• Physical Analysis Methodology
• Package
• Package View, Dimensions & Pin-out
• Package X-Ray
• Package Opening
• Package Cross-Section
• Die
• View, Dimensions & Marking
• MEMS Sensing Area: Gyroscope
• MEMS Sensing Area: X/Y-Axis Accelerometer
• MEMS Sensing Area: Z-Axis Accelerometer
• MEMS Cap
• ASIC Delayering & Process
• Die Cross-Section: ASIC
• Die Cross-Section: MEMS
• Die Cross-Section: Sensor
• Die Cross-Section: Cap

Comparison with previous generation

Manufacturing Process Flow

• Global Overview
• IC Front-End Process
• MEMS Process Flow
• Wafer Fabrication Unit
• Packaging Process Flow
• Package Assembly Unit

Cost Analysis

• Main steps of economic analysis
• Yields Hypotheses
• ASIC Front-End Cost
• MEMS Front-End Cost
• ASIC/MEMS Assembly Cost
• MEMS Front-End Cost per process steps
• MEMS Front-End: Equipment Cost per Family
• MEMS Front-End: Material Cost per Family
• Total Front-end Cost
• Back-End 0 : Probe Test & Dicing
• Wafer & Die Cost
• Back-End : Packaging Cost
• Back-End : Final Test & Calibration Cost
• MPU-6500 Component Cost

Estimated Price Analysis

• InvenSense Financial Ratios
• MPU-6500 Estimated Price

For more information visit http://www.researchandmarkets.com/research/x4j479/invensense

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets