Accessibility Statement Skip Navigation
  • Resources
  • Blog
  • Journalists
  • +44 (0)20 7454 5110
  • Client Login
  • Send a Release
Return to PR Newswire homepage
  • News
  • Products
  • Contact
When typing in this field, a list of search results will appear and be automatically updated as you type.

Searching for your content...

No results found. Please change your search terms and try again.
  • News in Focus
      • Browse News Releases

      • All Public Company News
      • All Multimedia News
      • View All News Releases

      • Regulatory News

      • D/A/CH Regulatory News
      • UK Regulatory News
      • View All Regulatory News

  • Business & Money
      • Auto & Transportation

      • Aerospace & Defense
      • Air Freight
      • Airlines & Aviation
      • Automotive
      • Maritime & Shipbuilding
      • Railroads & Intermodal Transportation
      • Supply Chain/Logistics
      • Transportation, Trucking & Railroad
      • Travel
      • Trucking & Road Transportation
      • View All Auto & Transportation

      • Business Technology

      • Blockchain
      • Broadcast Tech
      • Computer & Electronics
      • Computer Hardware
      • Computer Software
      • Data Analytics
      • Electronic Commerce
      • Electronic Components
      • Electronic Design Automation
      • Financial Technology
      • High Tech Security
      • Internet Technology
      • Nanotechnology
      • Networks
      • Peripherals
      • Semiconductors
      • View All Business Technology

      • Entertain­ment & Media

      • Advertising
      • Art
      • Books
      • Entertainment
      • Film & Motion Picture
      • Magazines
      • Music
      • Publishing & Information Services
      • Radio & Podcast
      • Television
      • View All Entertain­ment & Media

      • Financial Services & Investing

      • Accounting News & Issues
      • Acquisitions, Mergers & Takeovers
      • Banking & Financial Services
      • Bankruptcy
      • Bond & Stock Ratings
      • Conference Call Announcements
      • Contracts
      • Cryptocurrency
      • Dividends
      • Earnings
      • Earnings Forecasts & Projections
      • Financing Agreements
      • Insurance
      • Investments Opinions
      • Joint Ventures
      • Mutual Funds
      • Private Placement
      • Real Estate
      • Restructuring & Recapitalisation
      • Sales Reports
      • Shareholder Activism
      • Shareholder Meetings
      • Stock Offering
      • Stock Split
      • Venture Capital
      • View All Financial Services & Investing

      • General Business

      • Awards
      • Commercial Real Estate
      • Corporate Expansion
      • Earnings
      • Environmental, Social and Governance (ESG)
      • Human Resource & Workforce Management
      • Licensing
      • New Products & Services
      • Obituaries
      • Outsourcing Businesses
      • Overseas Real Estate (non-US)
      • Personnel Announcements
      • Real Estate Transactions
      • Residential Real Estate
      • Small Business Services
      • Socially Responsible Investing
      • Surveys, Polls & Research
      • Trade Show News
      • View All General Business

  • Science & Tech
      • Consumer Technology

      • Artificial Intelligence
      • Blockchain
      • Cloud Computing/Internet of Things
      • Computer Electronics
      • Computer Hardware
      • Computer Software
      • Consumer Electronics
      • Cryptocurrency
      • Data Analytics
      • Electronic Commerce
      • Electronic Gaming
      • Financial Technology
      • Mobile Entertainment
      • Multimedia & Internet
      • Peripherals
      • Social Media
      • STEM (Science, Tech, Engineering, Math)
      • Supply Chain/Logistics
      • Wireless Communications
      • View All Consumer Technology

      • Energy & Natural Resources

      • Alternative Energies
      • Chemical
      • Electrical Utilities
      • Gas
      • General Manufacturing
      • Mining
      • Mining & Metals
      • Oil & Energy
      • Oil & Gas Discoveries
      • Utilities
      • Water Utilities
      • View All Energy & Natural Resources

      • Environ­ment

      • Conservation & Recycling
      • Environmental Issues
      • Environmental Policy
      • Environmental Products & Services
      • Green Technology
      • Natural Disasters
      • View All Environ­ment

      • Heavy Industry & Manufacturing

      • Aerospace & Defence
      • Agriculture
      • Chemical
      • Construction & Building
      • General Manufacturing
      • HVAC (Heating, Ventilation & Air-Conditioning)
      • Machinery
      • Machine Tools, Metalworking & Metallurgy
      • Mining
      • Mining & Metals
      • Paper, Forest Products & Containers
      • Precious Metals
      • Textiles
      • Tobacco
      • View All Heavy Industry & Manufacturing

      • Telecomm­unications

      • Carriers & Services
      • Mobile Entertainment
      • Networks
      • Peripherals
      • Telecommunications Equipment
      • Telecommunications Industry
      • VoIP (Voice over Internet Protocol)
      • Wireless Communications
      • View All Telecomm­unications

  • Lifestyle & Health
      • Consumer Products & Retail

      • Animals & Pets
      • Beers, Wines & Spirits
      • Beverages
      • Bridal Services
      • Cannabis
      • Cosmetics & Personal Care
      • Fashion
      • Food & Beverages
      • Furniture & Furnishings
      • Home Improvement
      • Household, Consumer & Cosmetics
      • Household Products
      • Jewellery
      • Non-Alcoholic Beverages
      • Office Products
      • Organic Food
      • Product Recalls
      • Restaurants
      • Retail
      • Supermarkets
      • Toys
      • View All Consumer Products & Retail

      • Entertain­ment & Media

      • Advertising
      • Art
      • Books
      • Entertainment
      • Film & Motion Picture
      • Magazines
      • Music
      • Publishing & Information Services
      • Radio & Podcast
      • Television
      • View All Entertain­ment & Media

      • Health

      • Biometrics
      • Biotechnology
      • Clinical Trials & Medical Discoveries
      • Dentistry
      • FDA Approval
      • Fitness/Wellness
      • Health Care & Hospitals
      • Health Insurance
      • Infection Control
      • International Medical Approval
      • Medical Equipment
      • Medical Pharmaceuticals
      • Mental Health
      • Pharmaceuticals
      • Supplementary Medicine
      • View All Health

      • Sports

      • General Sports
      • Outdoors, Camping & Hiking
      • Sporting Events
      • Sports Equipment & Accessories
      • View All Sports

      • Travel

      • Amusement Parks & Tourist Attractions
      • Gambling & Casinos
      • Hotels & Resorts
      • Leisure & Tourism
      • Outdoors, Camping & Hiking
      • Passenger Aviation
      • Travel Industry
      • View All Travel

  • Policy & Public Interest
      • Policy & Public Interest

      • Animal Welfare
      • Corporate Social Responsibility
      • Economic News, Trends & Analysis
      • Education
      • Environmental
      • European Government
      • Labour & Union
      • Natural Disasters
      • Not For Profit
      • Public Safety
      • View All Policy & Public Interest

  • People & Culture
      • People & Culture

      • Aboriginal, First Nations & Native American
      • African American
      • Asian American
      • Children
      • Diversity, Equity & Inclusion
      • Hispanic
      • Lesbian, Gay & Bisexual
      • Men's Interest
      • People with Disabilities
      • Religion
      • Senior Citizens
      • Veterans
      • Women
      • View All People & Culture

  • Overview
  • Distribution
  • Paid Placement
  • Multimedia
  • Disclosure Services
  • SocialBoost
  • Rooms
    • MediaRoom
    • ESG Rooms
  • AI Tools
  • General Enquiries
  • Media Enquiries
  • Partnerships
  • Hamburger menu
  • Cision PR Newswire UK provides press release distribution, targeting, monitoring, and marketing services
  • Send a Release
    • Phone

    • +44 (0)20 7454 5110 from 8 AM - 5:30 PM GMT

    • ALL CONTACT INFO
    • Contact Us

      +44 (0)20 7454 5110
      from 8 AM - 5:30 PM GMT

  • Client Login
  • Send a Release
  • Resources
  • Blog
  • Journalists
  • News in Focus
    • Browse News Releases
    • Regulatory News
  • Business & Money
    • Auto & Transportation
    • Business Technology
    • Entertain­ment & Media
    • Financial Services & Investing
    • General Business
  • Science & Tech
    • Consumer Technology
    • Energy & Natural Resources
    • Environ­ment
    • Heavy Industry & Manufacturing
    • Telecomm­unications
  • Lifestyle & Health
    • Consumer Products & Retail
    • Entertain­ment & Media
    • Health
    • Sports
    • Travel
  • Policy & Public Interest
    • Policy & Public Interest
  • People & Culture
    • People & Culture
  • Client Login
  • Send a Release
  • Resources
  • Blog
  • Journalists
  • Overview
  • Distribution
  • Paid Placement
  • Multimedia
  • Disclosure Services
  • Cision Communications Cloud®
  • AI Tools
  • Client Login
  • Send a Release
  • Resources
  • Blog
  • Journalists
  • General Enquiries
  • Media Enquiries
  • Partnerships
  • Client Login
  • Send a Release
  • Resources
  • Blog
  • Journalists

IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights

This image opens in the lightbox

News provided by

IDTechEx

10 Jan, 2024, 07:32 GMT

Share this article

Share toX

Share this article

Share toX

BOSTON, Jan. 10, 2024 /PRNewswire/ -- Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.

Four critical parameters shape advanced semiconductor packaging: power, performance, area, and cost:

Continue Reading
This image opens in the lightbox
Overview of advanced semiconductor packaging technologies. Source: IDTechEx - "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications"

  1. Power: Enhancing power efficiency through innovative packaging technologies.
  2. Performance: Boosting bandwidth and reducing communication length by shortening interconnection pitch for more input/output (I/O) points.
  3. Area:  Larger packaging area required for chips used in high performance computing areas, whereas smaller z-form factor are required for 3D integration.
  4. Cost: Continuously reducing packaging costs by employing alternative, more affordable materials or enhancing manufacturing equipment efficiency

2.5D and 3D packaging technology:

The 2.5D and 3D packaging technologies encompass various packaging techniques.

In 2.5D packaging, the choice of interposer material categorizes it into Si-based, Organic-based, and glass-based interposers, as illustrated in the figure above. Meanwhile, in 3D packaging, the evolution of microbump technology aims for smaller pitch dimensions. However, achieving single-digit pitch dimensions today is made possible through the adoption of hybrid bonding technology, a method that directly connects Cu-Cu, signifying a significant advancement in the field.

Advantages and drawbacks of each packaging type in both 2.5D and 3D configurations 

2.5D

Si:  There are two alternatives within this category: Si interposer, utilizing a full passive Si wafer, and Si bridge, which can take the form of a localized Si bridge in a fan-out based molding compound or in a substrate with a cavity. The Si interposer, commonly employed in 2.5D packaging for high-performance computing integration due to its ability to facilitate the finest routing features, faces challenges associated with its cost in both materials and manufacturing compared to alternatives like organic materials, and the packaging area limitation. To address this, the localized Si bridge form is gaining prominence, strategically utilizing Si where fine features are essential. Additionally, the Si bridge structure is expected to see increased use, particularly in scenarios where Si interposer faces limitations in area, pushing beyond the 4x or 5x reticle limit.

Organic: In the report, we specifically consider organic-based packaging that utilizes a fan-out molding compound rather than an organic substrate. Organic materials, with the capability to adjust their dielectric constant lower than silicon, contribute to lower RC delay in the package. Moreover, these materials present a more cost-effective alternative to silicon. These advantages drive the emergence of organic-based 2.5D packaging. However, a key drawback lies in the challenges associated with achieving the same level of interconnect feature reduction as Si-based packages.

Glass:  The glass-based approach has gained significant interest following Intel's unveiling of its glass-based test vehicle package earlier this year. Glass possesses advantageous properties, including tunable Coefficient of Thermal Expansion (CTE), high dimensional stability, and a smooth, flat surface. These characteristics position glass as a promising candidate for serving as an interposer, with routing features that have the potential to rival those offered by silicon. However, the main drawback of glass lies in its immature ecosystem and a current lack of large-volume mass production capability in the packaging industry. Nevertheless, as the ecosystem matures and production capabilities advance, the use of glass-based technologies in semiconductor packaging may see further growth.

3D

Microbump:  The well-established microbump technology, based on the Thermal Compression Bonding (TCB) process, has a longstanding presence across diverse products. Its roadmap involves ongoing scaling of bumping pitch. However, a critical challenge emerges as smaller solder ball sizes in this process result in heightened Intermetallic Compounds (IMCs) formation, diminishing conductivity and mechanical properties. Additionally, close contact gaps may lead to solder ball bridging, risking chip failure during reflow. With solder and IMCs exhibiting higher resistivity than copper, their use in high-performance component packaging faces limitations.

Hybrid bonding:   Hybrid bonding involves creating permanent interconnections by combining a dielectric material (SiO2) with embedded metal (Cu). With Cu-Cu hybrid bonding achieving pitches below 10 micrometers (typically around one-digit µm), advantages include expanded I/O, increased bandwidth, enhanced 3D vertical stacking, heightened power efficiency, and reduced parasitics and thermal resistance due to the absence of underfill. Challenges encompass manufacturing complexities and higher costs associated with this advanced technique.

IDTechEx's new report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", thoroughly explores the latest innovations in semiconductor packaging technology, covering key technical trends, analyzing the value chain, evaluating major players, and providing detailed market forecasts.

The report recognizes the crucial role of advanced semiconductor packaging as the foundation for next-generation ICs. It focuses on its applications in key markets such as AI and data centers, 5G, autonomous vehicles, and consumer electronics. Leveraging IDTechEx's expertise in these sectors, the report delivers a comprehensive understanding of the impact and future trajectory of advanced semiconductor packaging in these critical fields.

Key aspects of this report:

Exploring Technology Trends and Manufacturers in Advanced Semiconductor Packaging:

  • Explore advanced semiconductor packaging evolution, addressing transistor IC challenges. Examine how chiplet concepts and heterogeneous integration propel advanced packaging adoption.
  • Analyze Packaging Technologies: Segment by interposer material (Si, Glass, Organic), covering roadmaps, benchmarks, applications, players, and manufacturing barriers.
  • Company Analysis: In-depth examination of key companies, assessing solutions, clientele, applications, and technology roadmap.
  • Key Markets: Provide detailed overviews for critical markets - high-performance computing, autonomous vehicles, 5G, and consumer electronics.
  • Case Studies: Showcase various industry applications of advanced semiconductor packaging.
  • Supply Chain & Models: Analyze supply chain dynamics and business models in this evolving landscape.

10-year Granular Market Forecasts & Analysis:

  • Data Center Server Unit Forecast 2023-2034 (Shipment)
  • Data Center CPU: Advanced Semiconductor Packaging Forecast 2023-2034 (Shipment)
  • Data Center Accelerator: Semiconductor Packaging Forecast 2023-2034 (Shipment)
  • 2.5D Semiconductor Packaging for L4+ Autonomous Vehicles 2023-2045
  • 3D Semiconductor Packaging for L4+ Autonomous Vehicles 2023-2045
  • Consumer Electronics Unit Sales Forecast 2023-2034 (Smartphones/Tablets/Smartwatches/AR/VR/MR)
  • Advanced Semiconductor Packaging Forecast for APE in Consumer Electronics 2023-2034
  • Global PC Shipment Forecast 2023-2034
  • Advanced Semiconductor Packaging in PC Forecast 2023-2034
  • 5G Radios by MIMO Size Unit Forecast 2023-2034
  • Advanced Semiconductor Packaging for 5G RAN Networks 2023-2034

To find out more about this new IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/ASP.

Free-to-attend upcoming webinar

Advancement in 2.5D and 3D Semiconductor Packaging Technologies

Dr Yu-Han Chang, Senior Technology Analyst at IDTechEx and author of this article, will be presenting a free-to-attend webinar on the topic on Wednesday 17 January 2024 - Advancement in 2.5D and 3D Semiconductor Packaging Technologies.

This webinar will reveal insights into 2.5D and 3D advanced semiconductor packaging technologies and the content include:

  • 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
  • 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
  • Market outlook for 2.5D and 3D packaging technologies

Click here to find out more and register your place on one of our three sessions. If you are unable to make the date, please register anyway to receive the links to the on-demand recording (available for a limited time) and webinar slides as soon as they are available.

About IDTechEx

IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com.

Images download:
https://www.dropbox.com/scl/fo/yqsvbetwv1dgws1q35vk1/h?rlkey=8a9yvn7clgxw4wxndfe5ebo8k&dl=0

Media Contact:
Lucy Rogers
Sales and Marketing Administrator
press@IDTechEx.com
+44(0)1223 812300

Social Media Links:

Twitter: www.twitter.com/IDTechEx
LinkedIn: www.linkedin.com/company/IDTechEx

Photo - https://mma.prnewswire.com/media/2314250/IDTechEx.jpg
Logo - https://mma.prnewswire.com/media/478371/IDTechEx_Logo.jpg

Modal title

Also from this source

IDTechEx Forecasts US$110B Worth of Critical Materials Recovered Annually by 2045

IDTechEx Forecasts US$110B Worth of Critical Materials Recovered Annually by 2045

End-of-life equipment from automotives, electric vehicles, e-waste and decarbonized energy technologies are rapidly emerging secondary raw material...

Roboshuttles: A Promising Yet Challenging Mobility Solution, Finds New IDTechEx Report

Roboshuttles: A Promising Yet Challenging Mobility Solution, Finds New IDTechEx Report

Roboshuttles are small, fully electric, and operate at Level 4 autonomy, making them an ideal last-mile solution. They were once highly anticipated...

More Releases From This Source

Explore

Computer & Electronics

Computer & Electronics

Semiconductors

Semiconductors

Electronic Components

Electronic Components

Publishing & Information Services

Publishing & Information Services

News Releases in Similar Topics

Contact PR Newswire

  • +44 (0)20 7454 5110
    from 8 AM - 5:30 PM GMT
  • General Enquiries
  • Media Enquiries
  • Partnerships

Products

  • Content Distribution
  • Multimedia Services
  • Disclosure Services
  • Cision Communications Cloud®

About

  • About PR Newswire
  • About Cision
  • Partnering Opportunities
  • Careers
  • APAC
  • APAC - Simplified Chinese
  • APAC - Traditional Chinese
  • Brazil
  • Canada
  • Czech
  • Denmark
  • Finland
  • France
  • Germany
  • India
  • Indonesia
  • Israel
  • Japan
  • Korea
  • Mexico
  • Middle East
  • Middle East - Arabic
  • Netherlands
  • Norway
  • Poland
  • Portugal
  • Russia
  • Slovakia
  • Spain
  • Sweden
  • United States
  • Vietnam

My Services

  • All News Releases
  • Customer Portal
  • Resources
  • Blog
  • Journalists
  • Data Privacy

Do not sell or share my personal information:

  • Submit via Privacy@cision.com 
  • Call Privacy toll-free: 877-297-8921

Contact PR Newswire

Products

About

My Services
  • All News Releases
  • Customer Portal
  • Resources
  • Blog
  • Journalists
+44 (0)20 7454 5110
from 8 AM - 5:30 PM GMT
  • Terms of Use
  • Privacy Policy
  • Information Security Policy
  • Site Map
  • RSS
  • Cookie Settings
Copyright © 2025 PR Newswire Europe Limited. All Rights Reserved. A Cision company.