Global Laser Cutting, Drilling, Marking and Engraving Market Report (2013 - 2018)

DUBLIN, Dec. 12, 2013 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/lcpqr3/laser_cutting) has announced the addition of the "Global Laser Cutting, Drilling, Marking and Engraving Market Report (2013 - 2018)" report to their offering.

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Since its advent in 1957, the early adopters of laser (light amplification by simulated emission of radiation) technology were applications such as; ranging, targeting, spectroscopy, and microscopy. The purpose of these applications was either the exploration/measurement of distances or the scientific/laboratory experiments. None of the above mentioned application promoted laser technology on the commercial front such as laser processing. However, with the technological developments, lasers became compact, robust, and versatile. Such developments triggered the industrial and commercial applications such as; micro-machining, modeling, precise sculpting, shaping & sizing objects and materials, and contactless imprinting which now are collectively referred to as laser processing applications.

The revenue generated from laser processing applications is supported by five critical pillars - laboratory equipments, defense & military, compact disc read/write heads, communications, and material processing. The research study, Laser Processing Market (2013 - 2018) analyses the vital material processing segment. The analysis is complemented by qualitative as well as quantitative data; latter being further divided into sales value, sale volume, and average selling price (ASP) data sets. Each of the data set contains historical, estimated, and forecasted values. The total laser processing market is segmented according to the technology, laser processing techniques, machine configuration, vertical, and geography.

Key Topics Covered:

1 Introduction
1.1 Key Take-Aways
1.2 Report Description
1.3 Markets Covered
1.4 Stakeholders
1.5 Report Assumptions
1.6 Research Methodology

2 Executive Summary

3 Cover Story

4 Market Overview
4.1 Introduction
4.2 Market Definition Andscope
4.3 Market Segmentation
4.4 History And Evolution Of Laser Processing Market
4.5 Technology And Application Trends
4.6 Advantages Of Laser Material Processing
4.7 The Industrial Safety Factors
4.8 Market Dynamics
4.9 Burning Issues
4.10 Winning Imperatives
4.11 Porter's Five Forces Model
4.12 Value Chain
4.13 Price Trend Analysis

5 Segmentation By Technology
5.1 Introduction
5.2 Lasers Source And Laser System Market Comparison
5.3 Gas Lasers
5.4 Solid State Lasers
5.5 Fiber Lasers
5.6 Semiconductor Lasers

6 Segmentation By Process
6.1 Introduction
6.2 Cutting And Drilling
6.3 Marking And Engraving
6.4 Micro-Processing
6.5 Advanced Processing

7 Segmentation By Machine Configuration
7.1 Introduction
7.2 Types Of Configuration For Laser Cutting
7.3 Types Of Configuration For Laser Engraving

8 Segmentation By Vertical
8.1 Introduction
8.2 Aerospace
8.3 Architecture
8.4 Automotive
8.5 Commercial
8.6 Consumer Electronics
8.7 General Machine Tooling
8.8 Semiconductor & Electronics

9 Segmentation By Geography
9.1 Introduction
9.2 North America
9.3 Europe
9.4 Apac
9.5 Row

10 Competitive Landscape
10.1 Overview
10.2 Market Share Analysis
10.3 Key Growth Strategies
10.4 Competitive Situation And Trends

11 Company Profiles

Companies Mentioned:

• Alltec Gmbh
• Alpha Nov Laser
• Bystronic, Inc.
• Coherent, Inc.
• Dpss Laser, Inc.
• Epilog Laser, Inc.
• Eurolaser Gmbh
• Ipg Photonics Corporation
• Jenoptik Laser Gmbh
• Laserstar Technologies Corporation
• Needham Laser Ltd.
• Newport Corporation
• Prima Industrie S.P.A.
• Q-Peak, Inc.
• Rofin-Sinar Technologies, Inc.
• Sei Laser S.P.A
• Trotec Laser, Inc.
• Trumpf Laser Gmbh + Co. Kg
• Universal Laser Systems, Inc.
• Xenetech Global, Inc.

For more information visit http://www.researchandmarkets.com/research/lcpqr3/laser_cutting

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net