Embedded Die in Package Patent Investigation Report

DUBLIN, January 30, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/fnr3bh/embedded_die_in) has announced the addition of the "Embedded Die in Package Patent Investigation Report" report to their offering. 

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Embedded IC in package technology is a young and promising advanced packaging technique: understanding the status of the patent situation is key to understanding the business environment and anticipating the related strategic evolutions!

A very young patent landscape dominated by a very small number of companies...

For this patent analysis 721 relevant and related patents have been selected and classified to further analyze embedded IC IP situation.

Among the 1547 patent documents constituting the 596 relevant patent families, 84% are active (pending or granted) and 16% are inactive (revoked, expired or lapsed).

In addition, even if first patents for embedded IC are quite old, this technology is very young with regard to the number of patents pending!

About 180 assignees are involved in embedded die technologies while the top 10 assignees represent 53% of patents filed in the Embedded die domain.
Main business model involved in this area is substrate & PCB makers (which have been strongly involved in the PCB and back-end industries for a while) but we found a significant number of IDMs and OSATs which are looking closer and closer to this packaging technology.

Patents in the embedded domain are mainly filed by firms or universities located in Korea (33%), Japan (21%) and USA (19%). Japanese and American players were the early adopters of the technology and they are still deeply involved in this business. Korea emerged as new key player in 2005.

We selected 10 companies among the most active players identified in this complete statistical analysis to lead an accurate description of their patent portfolios.

The report also provides a database of all the relevant patents we have analyzed in an Excel file, which allows multi-criteria searches. The criteria are basically those we used for the technological segmentation:

• Patent information: Patent publication number, link to the PDF, document, oldest priority date, title, assignee, patent potential ranking, nb of citing patent families
• Technological segmentation: chip placement / bonding, tape lamination, RDL, passivation & balling

This complete description of the patent landscape is included in the first part of the report and provides all the background material for the analysis of the embedded IC in package landscape. The report provides a complete analysis of the patent landscape including geographical origins of the patents, company or R&D organizations that have been granted the patents, historical data on when the companies have applied for patents in the last 20 years, inventors of the patents, expiration status, R&D collaborations.

Detailed analysis of the TOP 10 patent assignees for Embeded IC technology

The report provides a deep dive into each of the patent portfolios of Yole Développement selected assignees, including SEMCO, ASE, Samsung, Unimicron, Intel, Imbera, Shinko, Murata, LG Innotek, Daeduck. 

For each of these companies, the report provides an in-depth analysis of the patent portfolio, highlighting the following points:

• Company profile
• Company patent portfolio evolution
• Countries of deposition and origin of the patents
• Top inventors
• Technical segmentation of each patent portfolio
• Patent portfolio analysis for each manufacturing process step and architecture
• Main technical innovations

Key Topics Covered: 

1. Context and objectives 

2. Introduction to embedded IC market and technology 

3. Methodology for patent screening and analysis 

4. IP landscape overview 

5. Global patent ranking and patent potential analysis 

6. Key player patent portfolio analysis

7. Link with existing product and commercialized solutions 

8. Conclusions and perspectives 

9. Introduction & presentation of Yole Développement activity 

Companies Mentioned:

• Amkor
• Analog Devices
• Epcos
• Fairchild
• Flip Chip International
• Fraunhofer IZM
• Fujitsu
• Hermes
• Ibiden
• Imbera
• IMEC
• Intel
• Ipdia
• LG
• Maxim
• Microchip
• Murata
• National Semiconductor
• NEC
• Sony
• SPIL
• STATS ChipPAC
• STEricsson
• STMicroelectronics
• TDK
• Taiyo Yuden
• Texas Instruments
• Toshiba
• Unimicron
• UTAC
• VTI (Murata)

For more information visit http://www.researchandmarkets.com/research/fnr3bh/embedded_die_in

Media Contact: Laura Wood, +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets