Complete Tear-Down Analysis of Qorvo's SMR BAW High Band Filter - TQF6405 - A Complete Front-End Module for High Band LTE Application - Research and Markets

DUBLIN, April 5, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the, "Qorvo TQF6405 - SMR BAW High Band Filter - Complete Tear-Down Analysis," report to their offering. 

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Qorvo started as a supplier for Apple's iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvo's Module in its flagship. In iPhone 6s series, Apple integrates Qorvo's LTE High Band Front-End Module. 

The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter. 

Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo. 

All dies present in the component uses TriQuint's proven front-side Cu/Sn pillar technology (Cu-Flip) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm². 

Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses. 

Thanks to its design and manufacturing process, Qorvo device is not sensitive to temperature and is cost effective in respect to its competitors. 

The report includes comparisons with the BAW filter from Avago, also found in the Apple iPhone 6s Plus. 

Key Topics Covered: 

1. Overview / Introduction 

2. Company Profile & Supply Chain 

3. Physical Analysis 
- Physical Analysis Methodology 
- Front-End Module disassembly 
-- Front-End Module Removal 
-- Front-End Module assembly view 
- Front-End Module assembly 
-- Front-End Module Views 
-- Front-End Module Cross-Section 
- Front-End Module Die 
-- Active device Die View & Dimensions 
-- Power Amplifier Cross-section 
-- SPDT switch Cross-Section 
- BAW filter Die 
-- BAW filter Die View & Dimensions 
-- BAW filter Die Opening 
-- BAW filter Die packaging cross-section 
-- BAW filter Die Copper Pillar & Cavity 
-- BAW filter Die Cross-section 
-- BAW filter Die membrane 

4. Manufacturing Process Flow 
- Front-End Module Die Front-End Process 
- Component Packaging Process 
- Fabrication unit 
- MEMS wafer process flow 
-- SMR process Flow 
-- Air cavity & Copper Pillar process flow 
- Final Test & Packaging 
- Synthesis of the main parts 

5. Cost Analysis 
- SMR-BAW Filter Wafer Front-End Cost 
- SMR-BAW Filter Wafer Front-End Cost per process 
- SMR-BAW Filter Front-End Probe Test, Thinning & Dicing Cost 
- SMR-BAW filter Die Cost 
- Estimated Manufacturer Price 

For more information visit http://www.researchandmarkets.com/research/t6jrp2/qorvo_tqf6405

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SOURCE Research and Markets