AIR PACKAGING TECHNOLOGIES, INC. AGREES FAR EAST ALLIANCE
Valencia, California, December 1 - Air Packaging Technologies, Inc. of Valencia, California, has announced it has reached an agreement to form an alliance with C-Pak Pte. of Singapore.
C-Pak Pte. is the world's 3rd largest manufacturer of products used to ship Integrated Circuits in the Semiconductor Industry. C-Pak Pte. will introduce Air Packaging Technology products to the Semiconductor Industry in the Far East. They report a high level of customer acceptance of Air Packaging products from their initial market research.
The management of C-Pak Pte. brings an average of 20 years experience in the Semiconductor Industry to the alliance, having built excellent relationships with senior Semiconductor managements world wide.
There are in excess of 1,200 Wafer Fabrication facilities throughout the world, which need to be sold and serviced. This alliance combined with the previous European alliance of Air Packaging (Europe) will allow Air Packaging Technologies to take full advantage of the sales opportunity of marketing and servicing the SDSTM AIR BOX® products to the multi-nationals in the Semiconductor Industry world wide.
Garvin McMinn President & CEO,
Air Packaging Technologies, Inc.
SOURCE Air Packaging Technologies
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